Used AMAT / APPLIED MATERIALS DPS II AE Mesa #9292403 for sale

AMAT / APPLIED MATERIALS DPS II AE Mesa is an etcher/asher designed for the deposition and etching of complicated semiconductor materials. The state-of-the-art equipment features a Pulsed Discharge Sulfide (PDS) process technology as well as a precision control equipment for easy operation. The system has the ability to etch any pattern on the semiconductor surface with up to nine orbital angles and can precisely control the etch depth and degree of anisotropy. In addition to this process, AMAT DPS II AE Mesa provides adjustable angle etching for larger openings and can deposit up to a thickness of 20 microns with high aspect ratio and high throughput. The unit also features a powerful on-board scrubber that provides uniform etching throughout the entire substrate surface. This means that all device layers can be etched to the same precision with no contamination. Additionally, APPLIED MATERIALS DPS II AE Mesa features a non-SC1 etch module with variable etch and an adjustable pulse time. This module allows the machine to process materials at higher temperatures and thus increase etch throughput. Furthermore, the tool offers a high-precision linear drive mechanism and can process up to ninety-six substrates in series. This feature reduces down time, minimizes operator fatigue, and allows for quick and precise etching of challenging material sets. Additionally, the asset provides an environmental protection model with a multilayered filtration equipment to ensure a safe working environment. DPS II AE Mesa is an excellent choice for etching semiconductor devices, as the system can deliver uniform etching on all device layers with high throughput and precision. Its PDS process technology, variable angle etch, adjustable pulse time, and high-precision linear drive mechanism make it well-suited for the industry's most demanding jobs. This unit can help manufacturers optimize the efficiency of their production lines while reducing costs by minimizing down time and operator fatigue.