Used AMAT / APPLIED MATERIALS DPS II #293812243 for sale

AMAT / APPLIED MATERIALS DPS II (Dry Plasma Strip Equipment) is an etching/ashing system designed for precise and efficient removal of semiconductor materials. It utilizes a low-temperature de-ionized dry argon plasma to etch semiconductor wafers, enabling a quick and cost-effective way to achieve desired results. AMAT DPS II utilizes a unique dual-frequency unit that offers an adjustable power setting so that the user can target specific materials, ranging from simple silicon oxide films to high-density metallization layers. APPLIED MATERIALS DPS II features a modular design, allowing for easy upgradability to meet customers' needs. It features high-purity plasma for low particulate contamination, DC bias for better removal of silicon nitride, oxide, polysilicon, aluminum oxide, and thick aluminum films, and uniformity control as well as a wide selection of recipes. The unique plasma generator utilizes the two-frequency machine that adjusts the power setting for etching different materials effectively and accurately. The power range of DPS II is adjustable from 500 Watts to 1800 Watts, allowing for precise etching depths of specific material layers. Moreover, the tool allows for a choice of RF channel frequencies and variable etching times for maximum control. It also features high-purity de-ionized argon gas delivery, providing excellent selectivity and purity of the processed layers. AMAT / APPLIED MATERIALS DPS II is also designed for improved safety and operational ease. The etcher has an internal safety shield which prevents radiation leakage and gas leaks. The plasma control asset is also equipped with safety devices, including overcurrent and overvoltage protection features. Additionally, the controller features active-sensing and monitoring capabilities that provide real-time data about the etching process. It also has an intuitive user interface that allows for quick and accurate adjustments. AMAT DPS II is a powerful and efficient etching/ashing model designed for semiconductor wafer processing. It offers precise control over etching process thanks to the adjustable power settings, allowing for targeted removal of specific materials. Furthermore, the equipment is designed for improved safety, featuring an internal safety shield, gas leaks protection, and active-sensing and monitoring capabilities. Additionally, the intuitive user interface makes controlling the system quick and easy.