Used AMAT / APPLIED MATERIALS DPS II #293815928 for sale

AMAT / APPLIED MATERIALS DPS II is an etcher/asher used in the semiconductor industry for lithographic processes. It uses a multi-chamber, high-density plasma equipment to etch away unwanted material. The system uses a combination of chemicals, gases, and RF energy to create a plasma etch. It precisely controls the temperature and dwell time of the resulting plasma in order to ensure accuracy and productivity. AMAT DPS II utilizes etching technologies such as Inductively Coupled Plasma (ICP) and Reactive Ion Etching (RIE) to etch the desired material. These advanced etch technologies offer high etching rates, low rates of over-etch, and a uniformity of etch over the substrate surface. ICP provides high-rate etching on thinner substrates. Meanwhile, RIE etches thicker substrates with high-aspect ratios. The unit is equipped with an on-line Endpoint Detection (EPD) Machine that is used for measuring etch endpoint. This ensures that etching continues only until the desired endpoint has been reached and no further. It also prevents unnecessary over-etching and incorrect strip residue. The Endpoint Detection Tool ensures increased process consistency and yield. The asset also includes an Annealing Feature, used to anneal the substrate after etching. This produces improved device formation, with precise alignment of devices on the substrate. The model features an advanced Multi-Layer Etch Equipment (MLE), which is capable of performing sequential etching at different times and depths. This technology ensures high etch rates with high throughputs. Furthermore, the MLE allows for multiple etch processes to be done in one single etch chamber, so that the overall etch time is reduced and the etch process is more efficient. The system has a high-capacity loadlock chamber that can accommodate large 2" and 4" wafers. it is also equipped with uniformity control, enabling users to adjust the plasma profile before etching, to achieve uniform etching across the wafer. This ensures uniform results from the beginning of the etching process right to the end. The unit provides users with the ability to manually adjust the gas composition of the plasma for each specific etch process, giving them the power to optimize the etch process for their specific needs. This feature ensures that they can get the most out of their etching process. APPLIED MATERIALS DPS II is an advanced etcher/asher that boasts a platform of high-performance etching capabilities. It allows for increased accuracy, productivity and consistency of process results thanks to a wide variety of etch technologies and features like the Multi-Layer Etch Machine, Endpoint Detection Tool, and uniformity control. With adjustable gas composition and large wafer capacity, users can fine-tune the process to their needs. This etching asset is engineered to perform flawlessly and is tailor-made for achieving high quality results in lithographic processes.