Used AMAT / APPLIED MATERIALS DPS II #9192386 for sale

AMAT / APPLIED MATERIALS DPS II is an etcher/asher designed and constructed by AMAT, Inc. The versatile equipment is capable of etching and/or ashing a variety of wafer and ceramic materials in many semiconductor processes. AMAT DPS II's advanced Multi-ZoneTM Technology and Fusion™ Gas Delivery System allows for pre-conditioning and process control for product and application specific requirements. This capability optimizes performance and control of etching and ashing at the gate to gate level. APPLIED MATERIALS DPS II's etching and ashing processes are based on a controlled oxygen or nitrogen plasma chemistry. These processes can be tailored and adjusted in terms of Pressure, Current and Plasma. With DPS II, the process can be tuned to operate within its optimal range for both etching and ashing. In addition, the chamber and electrode arrangement are designed to produce an excellent flow distribution leading to uniform etch depths across the wafer. Another important feature of AMAT / APPLIED MATERIALS DPS II is its high-efficiency gas delivery unit. It is designed with a new dual-stage filtration machine to ensure high gas purity. This upgrades the cleaning quality of any process without increasing process time. It also enables higher process temperatures with reduced electrode fouling and improved electrical isolation. This, in turn, enables higher uniformity across the wafer. AMAT DPS II also includes a Automatic ReactorsTM feature to reduce defectivity and rework. It improves tuning of the process by automatically adjusting to the right set of etch parameters and eliminates the need to manually adjust the chamber conditions. This feature provides the ability to switch over to different process conditions quickly and efficiently. APPLIED MATERIALS DPS II also includes a comprehensive User Interface tool that allows users to monitor, track, and control the etching and/or ashing process in real time. It also provides a number of automatic process control features for improved accuracy and repeatability. Overall, DPS II is an etcher/asher designed to provide excellent repeatability, precision, and control of etching and ashing processes. It includes a Multi-ZoneTM Technology and Fusion™ Gas Delivery Asset to pre-condition the process to application-specific requirements. It also offers a high-efficiency gas delivery model, Automatic ReactorsTM feature, and a comprehensive User Interface equipment for real-time process monitoring and control.