Used AMAT / APPLIED MATERIALS DPS II #9255366 for sale

ID: 9255366
Wafer Size: 12"
Poly etcher, 12" ADVANCED ENERGY Navigator 3013 Source matcher, 3155132-004 ADVANCED ENERGY Navigator 1513 Bias matcher, 3155126-020 ADVANCED ENERGY APEX 3013 Source generator, 3156113-006 ADVANCED ENERGY APEX 1513 Bias generator, 3156110-005 ALCATEL / ADIXEN / PFEIFFER A100L Load lock pump PC: Pentium 4 Chamber A, B and C: ESC, 0041-26723 Ceramic lid, 0200-06404 Hub, 0200-04969 Gas nozzle, 0050-88146 Quartz single ring, 0200-04619 Insulator, Quartz, 0200-36034 Lower chamber liner, 0040-43977 Upper chamber liner, 0040-81156 Cathode liner, 0021-26273 Plasma screen, 0021-26274 Lift pin, 0200-04593 Plasma screen screw cover, 0200-00933 SLD Door, 0020-89739 TGV, 0190-29611 High voltage module, 0190-23905 Lid heater, 0090-04235 FE-ICP, 0010-37963 Source outer coil capacitor, 0630-00665 TGN Gas line, 0050-88146 Gas nozzle lower clamp, 0041-10491 Gas nozzle upper clamp, 0041-10490 PCB Water leak detector, 0190-02076 Interlock module, 0190-17964 CPCI 3U Quad serial communication, 0190-23509 CPCI48 Digital 48 I/O, 0190-07450 CPCI 32/16 Analog 32/16 I/O, 0190-22967 Dnet BUS scanner, SST CPCI, 0190-16926 SBC C400MHZ 3U 4HP 64M RAM Vx works, 0190-24007 One slot 3U Power supply, 0190-07502 Helium controller (IHC) assy, 0010-07061 Heater controller, 0190-26495 EyeD SRM, 0190-28658 EyD Fiber optic cable, 0190-19764 EPD Window point, 0200-02160 Manometer window port, 0200-39135 Chamber D: Throttle valve, 3870-03335 SLD Door, 0040-47461 Temperature controller, 0010-19317 Interlock module axiom, 12", 0190-15733 DIP Board, 0190-07450 AIO Board, 0190-22967 D-Net scanner board, 0190-16926 SBC Board, 0190-24007 Power supply board, 0190-07502 Serial communication board, 0190-23509 Pedestal, 0010-34860 Lift pin, 0021-43884 Top cap, GDP, Axiom HT, 0200-02980 Liner, side GDP, Axiom HT, 0200-02981 Lower GDP, HT2, Axiom, 0200-02272 Insert quartz glass, 3350-00048 Single ring, 0020-47977 Gas configuration: Chamber A: Gas / Name / Size Gas01 / BCL3 / 200 Gas02 / HBR / 500 Gas03 / CHF3 / 200 Gas04 / CL2 / 200 Gas05 / NF3 / 70 Gas06 / O2 / 200 Gas07 / O2_S / 20 Gas08 / SF6 / 50 Gas09 / CF4 / 300 Gas10 / N2 / 200 Gas11 / HE / 500 Gas12 / AR / 500 Chamber B: Gas / Name / Size Gas01 / BCL3 / 200 Gas02 / HBR / 500 Gas03 / CHF3 / 200 Gas04 / CL2 / 200 Gas05 / NF3 / 100 Gas06 / O2 / 200 Gas07 / O2_S / 20 Gas08 / SF6 / 50 Gas09 / CF4 / 300 Gas10 / N2 / 200 Gas11 / HE / 500 Gas12 / AR / 500 Chamber C: Gas / Name / Size Gas01 / BCL3 / 200 Gas02 / HBR / 500 Gas03 / CHF3 / 200 Gas04 / CL2 / 200 Gas05 / NF3 / 100 Gas06 / O2 / 1000 Gas07 / O2_S / 20 Gas08 / SF6 / 100 Gas09 / CF4 / 300 Gas10 / N2 / 200 Gas11 / HE / 500 Gas12 / AR / 500.
AMAT / APPLIED MATERIALS DPS II is an advanced etch/ash equipment designed to produce superior surface results in microelectronic applications. The system is composed of a multi-chamber ultra-high vacuum processing chamber, a unique ablation technology, and sophisticated sensor package. AMAT DPS II is ideal for tight process control in wet and dry etching, ashing and deposition processes. APPLIED MATERIALS DPS II was specifically designed for etching, ashing and deposition of dielectrics and semiconductor materials. Its ultra-high vacuum chamber is capable of achieving a pressure of less than 10-8 Torr and carbon-laced wall liners which minimize outgassing. An advanced ablation technology further improves unit performance, allowing for precise control of process parameters and reliable process repeatability. DPS II's advanced sensor package ensures precise control of the process parameters. It consists of two independent controllers and four pyrometers for temperature, pressure, and RF power monitoring. Additionally, three thermocouples and four digitally-controlled mass flow controllers ensure repeatable, stable process control. Furthermore, the machine features an edge machine that provides superior wafer orientation detection, precision wafer manipulation, and wafer-directional cooling. The unique sensor package of AMAT / APPLIED MATERIALS DPS II provides a variety of benefits including superior temperature uniformity and stability of the chamber, increased throughput, and enhanced surface quality. Additionally, the advanced ablation technology allows for precise, repeatable etching, ashing and deposition process control. Furthermore, its multi-chamber design allows for the integration of multiple etch/ash processes in a single tool, saving time and money. Overall, AMAT DPS II is an advanced etch/ash asset designed to provide superior surface results in microelectronics applications. Its ultra-high vacuum chamber, unique ablation technology, and advanced sensor package ensure precise, repeatable process control. Additionally, its multi-chamber model design allows for the integration of multiple etch/ash processes in a single equipment, increasing throughput while minimizing costs.
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