Used AMAT / APPLIED MATERIALS DPS II #9255367 for sale
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ID: 9255367
Wafer Size: 12"
Poly etcher, 12"
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ALCATEL / ADIXEN / PFEIFFER A100L Load lock pump
PC: Pentium 4
Chamber A, B and C:
ESC, 0041-26723
Ceramic lid, 0200-06404
Hub, 0200-04969
Gas nozzle, 0050-88146
Quartz single ring, 0200-04619
Insulator, Quartz, 0200-36034
Lower chamber liner, 0040-43977
Upper chamber liner, 0040-81156
Cathode liner, 0021-26273
Plasma screen, 0021-26274
Lift pin, 0200-04593
Plasma screen screw cover, 0200-00933
SLD Door, 0020-89739
TGV, 0190-29611
High voltage module, 0190-23905
Lid heater, 0090-04235
FE-ICP, 0010-37963
Source outer coil capacitor, 0630-00665
TGN Gas line, 0050-88146
Gas nozzle lower clamp, 0041-10491
Gas nozzle upper clamp, 0041-10490
PCB Water leak detector, 0190-02076
Interlock module, 0190-17964
CPCI 3U Quad serial communication, 0190-23509
CPCI48 Digital 48 I/O, 0190-07450
CPCI 32/16 Analog 32/16 I/O, 0190-22967
Dnet BUS scanner, SST CPCI, 0190-16926
SBC C400MHZ 3U 4HP 64M RAM Vx works, 0190-24007
One slot 3U Power supply, 0190-07502
Helium controller (IHC) assy, 0010-07061
Heater controller, 0190-26495
EyeD SRM, 0190-28658
EyD Fiber optic cable, 0190-19764
EPD Window point, 0200-02160
Manometer window port, 0200-39135
Chamber D:
Throttle valve, 3870-03335
SLD Door, 0040-47461
Temperature controller, 0010-19317
Interlock module axiom, 12", 0190-15733
DIP Board, 0190-07450
AIO Board, 0190-22967
D-Net scanner board, 0190-16926
SBC Board, 0190-24007
Power supply board, 0190-07502
Serial communication board, 0190-23509
Pedestal, 0010-34860
Lift pin, 0021-43884
Top cap, GDP, Axiom HT, 0200-02980
Liner, side GDP, Axiom HT, 0200-02981
Lower GDP, HT2, Axiom, 0200-02272
Insert quartz glass, 3350-00048
Single ring, 0020-47977
Gas configuration:
Chamber A:
Gas / Name / Size
Gas01 / BCL3 / 200
Gas02 / HBR / 500
Gas03 / CHF3 / 200
Gas04 / CL2 / 200
Gas05 / NF3 / 100
Gas06 / O2 / 200
Gas07 / O2S / 20
Gas08 / SF6 / 50
Gas09 / CF4 / 300
Gas10 / N2 / 500
Gas11 / HE / 500
Gas12 / AR / 500
Chamber B:
Gas / Name / Size
Gas01 / BCL3 / 200
Gas02 / HBR / 500
Gas03 / CHF3 / 200
Gas04 / CL2 / 200
Gas05 / NF3 / 100
Gas06 / O2 / 1000
Gas07 / O2_S / 20
Gas08 / SF6 / 50
Gas09 / CF4 / 300
Gas10 / N2 / 500
Gas11 / HE / 500
Gas12 / AR / 400
Chamber C:
Gas / Name / Size
Gas01 / BCL3 / 200
Gas02 / HBR / 500
Gas03 / CHF3 / 200
Gas04 / CL2 / 200
Gas05 / NF3 / 100
Gas06 / O2 / 300
Gas07 / O2_S / 20
Gas08 / SF6 / 50
Gas09 / CF4 / 300
Gas10 / N2 / 300
Gas11 / HE / 500
Gas12 / AR / 500.
AMAT / APPLIED MATERIALS DPS II is an inductively coupled plasma (ICP) etch equipment. It is a high-end, large-scale, inductively coupled etch (ICE) system, with features like single-vessel batch etching, high process uniformity and high throughput. AMAT DPS II is a top-of-the-line etch unit, featuring four flow-through chambers, integrated into the machine. These chambers are designed to etch a variety of materials, including organic dielectric and metal films, as well as hardmask, epitaxial and wafer resistive layers. The tool can be configured to etch in either a single or multiple chamber mode, with up to four layers simultaneously. APPLIED MATERIALS DPS II also features advanced process control technology, with an integrated database based on recipes from customers and OEMs. This enables the asset to achieve good etch uniformity, high throughput and well-defined process parameters. DPS II has a wide range of etching chemistries, from CF4-based ‘hard mask’ etch and XeF2-based resist-etch to microwave-based carbon etch. The chemistry capability and flexibility of this model allows users to etch a variety of materials, ranging from Silicon to GaAs and beyond. AMAT / APPLIED MATERIALS DPS II also features an advanced voltage source Intelligent Power Supply, which provides adjustable power, frequency and compensation capability to enable precise, repeatable etches. The equipment can be integrated with a variety of process simulation software tools, providing a precise virtual model of the etch process and assisting with process optimization. AMAT DPS II has proven itself to be an important tool in the fabrication of microelectronic and optoelectronic components. Its flexibility, user-friendly interface and high-level process capability make it a valued part of the complex process required in fabricating high-performance, reliable components for semiconductor and opto-electronic applications.
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