Used AMAT / APPLIED MATERIALS eMax CT+ #293727706 for sale
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ID: 293727706
Wafer Size: 12"
Vintage: 2008
Etcher, 12"
Wafer cooling method: Wafer backside cooling by He gas
Wafer holding mechanism: Electrostatic adsorption (Ceramic ESC)
Chamber material: 6061-T6 Aluminium alloy
Chamber evacuation: Exhaust with a backing pump
Ultimate pressure: ≤ 1.3 x 10^-3 Pa
Chamber leak amount: ≤ 266 mPa/min
Pressure monitor: 1333 Pa
Pressure measurement range: 0 to atmospheric pressure
Pressure control: Throttle valve
Pressure interlock: half atom switch
Wall / Cathode temperature control: heat exchanger
Chamber wall circulating water flow sensor
Chamber cathode circulating water flow sensor
Process Kit: RAISED Si / Si
KALREZ 8575 Dry Clean Chamber vacuum seal
EDWARDS STP-A1603P 1600L/S 2 Turbo Pump
TOYOTA T100L Pump
EBARA ESR80WN Pump
MKS/ENI GHW12 RF Generator, 13.56 MHz, 1250 W
MKS/ENI B-5002-0SPECTRUM RF Generator, 2 MHz, 5000 W
ADVANCED ENERGY VHF2760 RF Generator, 60 MHz, 2700 W
Endpoint specification: Eye-D / 200-800nm
HV Power supply
Chamber liner: Yttrium liner
Gas panel specification:
AERA PI-980 MFC
Gas line connection: Single Line Drop (SLD) connection
SLD Specification:
TESCOM SLD Regulator
ENTEGRIS SLD Filter
CKD SLD Manual valve
Gas / Size
C4F6 / 100 SCCM
CH2F2 / 100 SCCM
CH3F / 100 SCCM
C4F8 / 100 SCCM
CF4 / 300 SCCM
CHF3 / 300 SCCM
O2 / 2000 SCCM
O2 / 200 SCCM
O2 / 20 SCCM
Ar / 200 SCCM
Ar / 2000 SCCM
N2 / 200 SCCM
(2) Load lock chambers:
Slow pump / fast pump switchable
Equipped with cool down function
Chamber material: 6061-T6 Aluminum alloy
Chamber pressure monitor: Convectron gauge
Chamber vacuum sealing method: Viton O-Ring
VAT Slit valve
Ultimate pressure: ≤ 13.3 Pa (100mTorr)
Chamber leak amount: ≤ 1.33 Pa (10mTorr/min)
Transfer chamber:
Chamber pressure control: Auto Pressure Control (APC)
Chamber material: 6061-T6 Aluminum alloy
Chamber pressure monitor: Convectron gauge
Chamber vacuum sealing method: Viton O-Ring
VAT Slit valve
Wafer transfer robot
Wafer blade: Dual blade
Chamber evacuation
Ultimate pressure: ≤ 13.3 Pa
Chamber leak amount: ≤ 1.33 Pa
Remote signal tower
Factory interface:
YASKAWA LM Track Atmospheric Transfer robot
No Right and left side storage pod
(3) Loadports
25-Wafers FOUP
No ionizer
E84 PIO Sensor
E99 Carrier ID
Wafer mapper
Power supply: 200/208 V, 60 Hz
2008 vintage.
AMAT / APPLIED MATERIALS eMax CT+ etcher / asher is a high performance apparatus that provides advanced etching and etch-back capabilities for the multi-layer deposition process. It is the ideal choice for etching and ashing a wide range of materials in the microelectronics and photonics industries. It provides precise process control through the use of advanced sensors, computer-aided design (CAD), and real-time laser imaging. AMAT EMAX_CT+ consists of seven process chambers designed for large-area processing. Each chamber is equipped with an integrated photoresist strip chamber, allowing for multiple processes to be done in one session. The wafer is delivered to APPLIED MATERIALS E-MAX CT+ process chamber via an automated cassette-feeder unit. It is then lowered into place and aligned with the substrate in the center of the chamber. The chambers are then heated and evacuated in order to ensure consistent ashing process results. The processing program is customized for each substrate and layer pattern based on the user's design. The wafer is then exposed to a pulsed ultra-violet laser, which etches the photoresist pattern without the need for additional chemicals or gases. This laser-assisted etching process reduces time and cost in comparison to traditional wet etching methods. EMAX_CT+ also features an optional high-efficiency electron-beam asher, which is capable of achieving a low total-etch stop-layer thickness with a high etching effectiveness. The electron-beam asher also utilizes an advanced temperature control equipment, ensuring that the ashing process is done at the correct temperature. AMAT / APPLIED MATERIALS EMAX_CT+ also comes with an advanced, real-time imaging system that allows users to monitor their wafers while they are being processed. This unit not only provides information on the progress of the process, but can also be used to detect any issues or irregularities that may occur during the etching process, which can then be addressed to improve results. APPLIED MATERIALS eMax CT+ etcher / asher is an advanced machine that provides precise process control and a wide range of features in order to ensure high-quality etching and ashing of complex substrates and layers. Its advanced laser imaging tool, temperature control, and electron-beam asher make it the perfect choice for large-scale microelectronics and photonics applications.
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