Used AMAT / APPLIED MATERIALS eMax CT+ #293727706 for sale

ID: 293727706
Wafer Size: 12"
Vintage: 2008
Etcher, 12" Wafer cooling method: Wafer backside cooling by He gas Wafer holding mechanism: Electrostatic adsorption (Ceramic ESC) Chamber material: 6061-T6 Aluminium alloy Chamber evacuation: Exhaust with a backing pump Ultimate pressure: ≤ 1.3 x 10^-3 Pa Chamber leak amount: ≤ 266 mPa/min Pressure monitor: 1333 Pa Pressure measurement range: 0 to atmospheric pressure Pressure control: Throttle valve Pressure interlock: half atom switch Wall / Cathode temperature control: heat exchanger Chamber wall circulating water flow sensor Chamber cathode circulating water flow sensor Process Kit: RAISED Si / Si KALREZ 8575 Dry Clean Chamber vacuum seal EDWARDS STP-A1603P 1600L/S 2 Turbo Pump TOYOTA T100L Pump EBARA ESR80WN Pump MKS/ENI GHW12 RF Generator, 13.56 MHz, 1250 W MKS/ENI B-5002-0SPECTRUM RF Generator, 2 MHz, 5000 W ADVANCED ENERGY VHF2760 RF Generator, 60 MHz, 2700 W Endpoint specification: Eye-D / 200-800nm HV Power supply Chamber liner: Yttrium liner Gas panel specification: AERA PI-980 MFC Gas line connection: Single Line Drop (SLD) connection SLD Specification: TESCOM SLD Regulator ENTEGRIS SLD Filter CKD SLD Manual valve Gas / Size C4F6 / 100 SCCM CH2F2 / 100 SCCM CH3F / 100 SCCM C4F8 / 100 SCCM CF4 / 300 SCCM CHF3 / 300 SCCM O2 / 2000 SCCM O2 / 200 SCCM O2 / 20 SCCM Ar / 200 SCCM Ar / 2000 SCCM N2 / 200 SCCM (2) Load lock chambers: Slow pump / fast pump switchable Equipped with cool down function Chamber material: 6061-T6 Aluminum alloy Chamber pressure monitor: Convectron gauge Chamber vacuum sealing method: Viton O-Ring VAT Slit valve Ultimate pressure: ≤ 13.3 Pa (100mTorr) Chamber leak amount: ≤ 1.33 Pa (10mTorr/min) Transfer chamber: Chamber pressure control: Auto Pressure Control (APC) Chamber material: 6061-T6 Aluminum alloy Chamber pressure monitor: Convectron gauge Chamber vacuum sealing method: Viton O-Ring VAT Slit valve Wafer transfer robot Wafer blade: Dual blade Chamber evacuation Ultimate pressure: ≤ 13.3 Pa Chamber leak amount: ≤ 1.33 Pa Remote signal tower Factory interface: YASKAWA LM Track Atmospheric Transfer robot No Right and left side storage pod (3) Loadports 25-Wafers FOUP No ionizer E84 PIO Sensor E99 Carrier ID Wafer mapper Power supply: 200/208 V, 60 Hz 2008 vintage.
AMAT / APPLIED MATERIALS eMax CT+ etcher / asher is a high performance apparatus that provides advanced etching and etch-back capabilities for the multi-layer deposition process. It is the ideal choice for etching and ashing a wide range of materials in the microelectronics and photonics industries. It provides precise process control through the use of advanced sensors, computer-aided design (CAD), and real-time laser imaging. AMAT EMAX_CT+ consists of seven process chambers designed for large-area processing. Each chamber is equipped with an integrated photoresist strip chamber, allowing for multiple processes to be done in one session. The wafer is delivered to APPLIED MATERIALS E-MAX CT+ process chamber via an automated cassette-feeder unit. It is then lowered into place and aligned with the substrate in the center of the chamber. The chambers are then heated and evacuated in order to ensure consistent ashing process results. The processing program is customized for each substrate and layer pattern based on the user's design. The wafer is then exposed to a pulsed ultra-violet laser, which etches the photoresist pattern without the need for additional chemicals or gases. This laser-assisted etching process reduces time and cost in comparison to traditional wet etching methods. EMAX_CT+ also features an optional high-efficiency electron-beam asher, which is capable of achieving a low total-etch stop-layer thickness with a high etching effectiveness. The electron-beam asher also utilizes an advanced temperature control equipment, ensuring that the ashing process is done at the correct temperature. AMAT / APPLIED MATERIALS EMAX_CT+ also comes with an advanced, real-time imaging system that allows users to monitor their wafers while they are being processed. This unit not only provides information on the progress of the process, but can also be used to detect any issues or irregularities that may occur during the etching process, which can then be addressed to improve results. APPLIED MATERIALS eMax CT+ etcher / asher is an advanced machine that provides precise process control and a wide range of features in order to ensure high-quality etching and ashing of complex substrates and layers. Its advanced laser imaging tool, temperature control, and electron-beam asher make it the perfect choice for large-scale microelectronics and photonics applications.
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