Used AMAT / APPLIED MATERIALS eMax CT+ #9193737 for sale

AMAT / APPLIED MATERIALS eMax CT+ is a high-performance etcher/asher used for various semiconductor processes. The equipment utilizes a high-efficiency double frequency etching and ashing technology for improved selectivity, process uniformity, and low cost-of-ownership. The CT+ is equipped with an advanced Interca-TM-based optical control system for accurate wafer-to-wafer control and allows for a wide range of etch-parameter settings. AMAT EMAX_CT+ asher is capable of etching target substrates between 25 and 200mm. It has a broad range of capabilities, including high-pressure, low-pressure, and variable pressure ashing, thermal ashing, and etching. Its auto-tuning unit quickly optimizes the ashing process condition for any given process. The CT+ is capable of achieving faster etch rates than other similar systems, which, combined with its small footprint, makes it an ideal choice for high-volume wafer processing. The machine is enclosed in a class-10 cleanroom-compatible housing and uses a high-flow, pumped enclosure to keep harmful products away from the operator. Its process stations are mounted on a clean room compatible robotic arm, and inputs to the tool include wafer lift pins, drive spindles, mask processing, and adjustable nozzle configurations. The programmable hot plate allows for precise etch stop control and ashing temperature stability. The asset's CF4 gas input is flow-controlled and monitored to maintain optimal process conditions. APPLIED MATERIALS E-MAX CT+ is suited for a wide range of applications, including semiconductor etching, photoresist stripping, mask and photoresist exposure, ashing, cleaning, and oxidation. It can be used for annealing and activation, metal deposition and etching, post-plasma treatments, and thin-film deposition. The model operates with low power consumption and generates minimal waste for a cost-effective and environmentally friendly solution. Its small size and high efficiency make it an ideal choice for high-volume wafer processing.