Used AMAT / APPLIED MATERIALS eMax CT+ #9271007 for sale

AMAT / APPLIED MATERIALS eMax CT+ Asher is a single-wafer processing equipment for etching and ashing applications. This system is capable of delivering the highest throughput and highest productivity in the industry, enabling customers to meet ever-increasing yield requirements and reduce costs. AMAT EMAX_CT+ is ideal for low- to medium-volume production and offers a wide range of product capabilities, such as high-precision etching, etching of complex high-aspect ratio structures, and offering excellent selectivity between aluminium and silicon. APPLIED MATERIALS E-MAX CT+ leverages the Advanced Chilling Technology (ACT) architecture, a precision, high-flow heater-cooler organization that enables fast process control and thermal characteristics. This proprietary architecture ensures an efficient and uniform thermal distribution across wafers and between die on a single wafer. It allows quick set up and excellent process control and tuning capability. The closed-loop unit and process controller are tightly connected and enable real-time monitoring and adjustment of recipe parameters without interrupting wafer processing. APPLIED MATERIALS eMax CT+ is capable of high-precision etching of dielectrics with sub-micron-level feature sizes (<0.5μm). Its customizable process program allows for fine-tuned optimization of the etching process for precise layer thickness control, a crucial parameter in device reliability. High temperature ranges (up to 300°C) enable etching of high-temperature resistant oxides, such as PECVD nitrides, and high selectivity between metal and SiO₂. AMAT eMax CT+ offers a choice of up to three end-point detection technologies, including UV Reflectance, Pyrometry, and Fluorescence measurements. This allows customers to select the best detection technique for their device architecture. For example, the Pyrometry endpoint detection is ideal for high aspect ratio via structures where a high degree of resolution is needed at the bottom of the structure. The Fluorescence endpoint detection is ideal for full-face-etching of large structures, while the UV Reflectance endpoint detection is ideal for thin-film etching. APPLIED MATERIALS EMAX_CT+ is an ideal platform for both the etching and ashing applications. Unique Dual Process Chamber technology provides the best of both worlds: a dry etching chamber for precise feature formation and a clean etching chamber for quick material removal, helping customers reduce cycle times and improve process yields. In addition, the built-in gas blending machine helps customers reduce cost of ownership and improve uptime by optimizing gas flow, pressure, and gas delivery with minimal manual intervention. In summary, AMAT E-MAX CT+ is a highly reliable, efficient, and accurate single-wafer processing tool for etching and ashing applications. Its Advanced Chilling Technology (ACT) architecture, high-temperature etching range, customizable process programs, and optional endpoint detection technologies make it the perfect choice for customers looking to maximize productivity, precision, and reliability.