Used APPLIED MATERIALS 0010-12814 #293823047 for sale

ID: 293823047
Wafer Size: 8"
Heater assembly, 8".
APPLIED MATERIALS 0010-12814 is a highly advanced etcher/asher equipment designed for precise and uniform plasma processing of substrates in semiconductor manufacturing. This state-of-the-art equipment incorporates a range of cutting-edge technologies and features to enable efficient and reliable processing of various materials with high repeatability and control. The system is equipped with a sophisticated plasma generation mechanism that utilizes a combination of gases such as oxygen, fluorine, and argon to create a plasma environment suitable for etching and ashing processes. The plasma source is carefully controlled to maintain stable process conditions and achieve the desired etch rates and selectivity for different materials. One of the key features of 0010-12814 unit is its advanced chamber design, which is engineered to provide uniform distribution of plasma across the substrate surface. This ensures consistent etch profiles and high process uniformity, which are essential for achieving tight process tolerances and device performance specifications in semiconductor fabrication. The machine also incorporates a precise temperature control tool to maintain the substrate at optimal temperatures during processing. This is critical for controlling the chemical reactions at the substrate surface and ensuring the quality and reproducibility of the etch and ash processes. The temperature control asset is designed to operate within tight tolerances to prevent overheating or cold spots on the substrate. APPLIED MATERIALS 0010-12814 is equipped with advanced process monitoring and control capabilities to enable real-time adjustments and optimizations during processing. The model features integrated metrology tools for in-situ monitoring of key process parameters such as etch rate, uniformity, selectivity, and endpoint detection. This allows operators to fine-tune process conditions on the fly and ensure consistent results across production runs. In addition to its process control features, 0010-12814 equipment offers a high degree of automation and recipe management capabilities. The system is equipped with a user-friendly interface that allows operators to program and store multiple process recipes for different materials and process requirements. This enables quick changeovers between different processing steps and facilitates rapid development of new process recipes. Furthermore, the unit is designed with safety and reliability in mind, incorporating features such as gas delivery systems with built-in safety interlocks, emergency shutdown procedures, and robust vacuum pumping systems. These features help to ensure the safe operation of the equipment and minimize the risk of accidents or process interruptions. Overall, APPLIED MATERIALS 0010-12814 is a versatile and high-performance etcher/asher machine that offers precision, repeatability, and process control for demanding semiconductor manufacturing applications. Its advanced capabilities make it well-suited for a wide range of etch and ash processes, including pattern transfer, surface cleaning, and material removal, making it an indispensable tool for semiconductor fabrication facilities seeking to achieve high yields and performance in their production processes.
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