Used APS / ADVANCED PLASMA SYSTEMS B6-S #9069944 for sale

APS / ADVANCED PLASMA SYSTEMS B6-S is an etcher/asher for use in semiconductor and microelectronics applications. Utilizing a remote RF source, APS B6-S enables users to etch and clean various materials including silica, silicon nitride, polysilicon, metals, and other materials used in semiconductor fabrication and processing. ADVANCED PLASMA SYSTEMS B6-S equipment is made up of several parts. The control unit contains the electronics and components needed to control RF power supply, temperature, pressure, and RF plasma parameters. The process chamber holds the product to be etched or cleaned and is constructed from aluminum and stainless steel. An RF generator is attached to the process chamber and is used for supplying energy to create a plasma of electrons and molecules for etching or ashing. A vacuum pump is used to evacuate the process chamber of oxygen and other gasses that can cause undesirable reactions. Finally, the system is enclosed in a housing with built-in thermal regulation and filtering for safe operation. The etching process begins when the unit is turned on and the process chamber is evacuated and the power supply is connected. The RF generator then injects electrical power into the chamber to create a reactive plasma of electrons and molecules. The excited particles bombard the surface of the material being etched, breaking the bonds of the material and releasing particles that are subsequently pumped away. The process can be precisely controlled by adjusting the RF power, pressure, temperature, and other parameters such as process time and flow rate. The etching depth is dependent upon the type of material being processed, as well as the amount of time the plasma is maintained in the chamber. B6-S machine can also be used to clean wafers or surfaces that have already been processed in order to remove contamination and particles left behind during the etching process. Using a cleaning technique called "sputtering", the atoms of the clean gas bombard the contaminated surface, breaking the bonds of those films or contamination and sputtering the particles away. The entire process can be adjusted for optimal cleaning, and the tool can be equipped with a special RF plasma source for increased performance. APS / ADVANCED PLASMA SYSTEMS B6-S represents an efficient, reliable, and economical etcher/asher for a variety of semiconductor and microelectronic applications, enabling users to precisely control the etching and cleaning processes for optimal surface coating and processing.