Used APTC Selex 200 #293768792 for sale

APTC Selex 200 is a cutting-edge etcher/asher equipment widely used in the semiconductor and microelectronics industries for plasma processing applications. This advanced equipment combines both etching and ashing functionalities, making it a versatile tool for substrate surface modification and material removal processes. At the core of Selex 200 is its high-power radiofrequency (RF) plasma source, which generates a low-temperature, highly reactive plasma environment essential for precise and uniform material etching. The system features a dual-chamber design, with one chamber dedicated to etching and the other to ashing, providing flexibility in processing different types of substrates and materials. The etching process in APTC Selex 200 involves the removal of material from the substrate surface through chemical reactions with the plasma species. The plasma source excites gas molecules introduced into the chamber, creating a mix of reactive species such as ions, radicals, and electrons. These species interact with the substrate surface, breaking chemical bonds and facilitating material removal. Selex 200 offers precise control over etching parameters, including gas flow rates, pressure, power, and temperature, allowing for customization of the process to achieve the desired etch rate, selectivity, and profile. The unit is equipped with advanced process monitoring and control capabilities, such as optical emission spectroscopy (OES) and endpoint detection, ensuring accurate process control and reproducibility. In addition to etching, APTC Selex 200 also features an ashing capability, which is used for removing organic residues and contaminants from the substrate surface. The ashing process involves the oxidation of organic materials by reactive oxygen species in the plasma, converting them into volatile byproducts that are pumped out of the chamber. The dual-chamber design of Selex 200 allows for seamless transition between etching and ashing processes, reducing process steps and increasing productivity. The machine is compatible with a wide range of gases, including fluorine-based and oxygen-based chemistries, offering flexibility in processing various types of materials such as silicon, silicon dioxide, and photoresists. APTC Selex 200 is equipped with advanced safety features, including vacuum interlocks, gas flow monitoring, and temperature sensors, ensuring operator and equipment protection during operation. The tool is designed for high-throughput processing, with efficient wafer handling and loading mechanisms to minimize downtime and increase productivity. Overall, Selex 200 is a state-of-the-art etcher/asher asset that provides high-performance plasma processing capabilities for applications requiring precise material removal and surface modification. With its advanced technology, versatile processing capabilities, and robust design, APTC Selex 200 is an ideal solution for research and production facilities in the semiconductor and microelectronics industries.