Used AXCELIS / FUSION ES3 #9389468 for sale

AXCELIS / FUSION ES3 is an etcher/asher model of plasma-based equipment widely used in the semiconductor industry for deep-submicron RIE (Reactive Ion Etching) and ashing applications. This model features a wide base and a specialized chamber designed to reduce changes in process parameters due to environmental variations. FUSION ES3 utilizes a multi-gas flow-control equipment with a revolutionary stepwise "exhaust injection system", which further contributes to improving performance and process yield. The temperature of the chamber is stabilized during the plasma process via a unique vertical thermal isolation unit that further enhances process repeatability and stability. The key components of AXCELIS ES3 are the process chamber, electron cyclotron resonance (ECR) source, active pumping, exhaust gas injection machine, and the software suite. The aluminum alloy chamber is designed and built with a rugged finned construction that ensures a low thermal mass and maximum exhaust velocity for minimized gas elimination cycling time. The chamber is further engineered for compatibility with the lithography and vacuum tool fluids. Additionally, this model features an advanced ECR source that helps to maintain constant plasma conditions throughout the entire etching/ashing process. The active pumping asset effectively evacuates the chamber down to acceptable pressure levels and maintains desired process conditions in relation to part speed and load. This model also supports repeatable operations with minimized pressure fluctuations. The exhaust gas injection equipment of this model operates with a variable frequency gas from exhaust lance that allows for automated control of the exhaust density in the process chamber. This feature helps maintain process conditions with better uniformity across the chamber. The software suite of this etcher/asher significantly reduces the setup and process time, providing a user friendly interface with simplified access to process parameters and frequency settings. It also includes measurements and analysis capabilities via the "Q Monitor" function, which helps keep track of key variables during etch/ash operation. The software also alerts the user when any process parameters reach critical or unsafe limits to provide total control over the process. Overall, ES3 etcher/asher offers a wide base option, designed chamber, advanced ECR source, active pumping, exhaust injections, and a powerful software suite, making it a powerful and reliable tool for deep-submicron RIE and ashing applications. Thus, it is an ideal solution for the semiconductor industry and related business.