Used AXCELIS / FUSION G03 #9261537 for sale
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ID: 9261537
Ozone asher
Dual chamber
Dual robot arm
(2) Cassettes auto loaders
(2) Gemini lift controllers, P/N: 423441
(2) Gemini end point detectors, P/N:322301
(2) Catalytic heat control modules CAT control, P/N: X322311.
AXCELIS / FUSION G03 is a state-of-the-art etcher / asher equipment designed for high-throughput production in the chip fabrication industry. This system is engineered with a robust robotic handling unit that can execute a variety of processes, from deep etching of polysilicon to shallow etching of nitride layers. The machine has a multi-chamber configuration that allows it to carry out multiple etch processes in a single sequence, with a cycle time of 30s to 4 minutes, depending on the recipe. The core of FUSION G03 is its Advanced Mode Synchronized Etch (AMS-E) architecture, which utilizes advanced computer controlled etch chambers that use an intelligent 32-bit controller running software to optimize etch profiles. It features multiple plasma sources with independent control of each chamber's RF frequency, plasma gas chemistry, and pressure - enabling optimized etch conditions for a variety of materials. Moreover, the tool is designed with a suite of recipe monitoring, wafer tracking, and chamber cleaning systems that ensure both process uniformity and production quality. In particular, the built-in Automated Process Control (APC) asset monitors the real-time process with automated wafer-level process tuning to improve recipe accuracy and reduce the need for manual tuning of recipes during production. The model also features an integrated vision equipment with a high-resolution camera, capable of fully imaging a wafer after etching, enabling both wafer-level process validation and defect-finding capability. Its inspection capabilities are further enhanced by a TeraScan WFS190 which can detect particle levels in the system by monitoring incoming wafer, via multiple probes. Overall, AXCELIS G03 is equipped with a wide variety of industry-leading features and technologies to ensure efficient, reliable, and high-yield production of chips. It offers fast etch rates, superior recipe accuracy, process uniformity, process optimization and wafer-level analysis, allowing chip manufacturers to maximize cost effectiveness and enhance their competitive edge.
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