Used AXCELIS / FUSION WSI #9083198 for sale
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AXCELIS / FUSION WSI is an etcher/asher equipment designed to etch and ash wafer-level integrated circuits (ICs) with up to 300 mm wafers. It provides a suite of features to enable rapid wafer processing, including multi-process, multi-chamber, and multi-recipe processing capability. FUSION WSI system consists of two main elements: the etch reactor and the asher. The etch reactor delivers both inductively coupled plasma (ICP) and radical plasma to etch integrated circuit patterns into the wafer surface. The ICP etch process results in very low selectivity ratios, which enables sharp, high-definition patterns to be created. The ICP is also used to etch shut off wall applications in several layers and over large areas. The asher enables both fluorine-based and metal-based ash processes to be used. This allows a wide range of different dopants, their concentrations, and oxides to be accurately placed on the ICs, enabling the desired electrical characteristics to be achieved. AXCELIS WSI unit enables time-saving multi-wafer batch processing. It has the capability to process as many as six wafers simultaneously, enabling high throughput production. The machine also has an intuitive user interface that simplifies the task of setting up the machine. Automation software ensures that the tool achieves repeatable results, and the user can set the parameters of the process for each layer in order to achieve their desired final product. The asset also offers flexibility when it comes to recipe management, allowing the user to save and recall recipes for different processes. This makes it easy to replicate results over multiple runs, ensuring consistent performance between batches. WSI model also offers excellent safety features, including a self-contained RF enclosure, which keeps personnel away from the process area. The equipment is also designed to run with minimal maintenance, ensuring high reliability and long system life. Overall, AXCELIS / FUSION WSI unit provides highly accurate and reliable results for etching and ash of wafer-level integrated circuits. It is a highly versatile and reliable machine, offering the user quick setup times, high throughput, repeatable results, and precise control over the process.
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