Used BMR ICP #9286878 for sale

BMR ICP (Inductively Coupled Plasma) is an etching and ashing system used for precision processing. It is a high-tech machine used for removing material from a substrate or wafer using a chemical etching process. ICP works off a reactive gas which is discharged either by localized induction or high-frequency application. The system uses these reactive gases to deliver a precise amount of energy to the substrate or wafer in order to safely etch or ashe the material. This results in precise shaping of the area to be etched and less material loss compared to other etching methods. The process is comprised of three stages. The first stage is the induction process in which a high-frequency field is used to create a chemical reaction between the reactive gas and the substrate or wafer. This chemoluminescence reaction produces heat and ionizes the gas molecules to produce active species. The second stage is the ashing process which occurs when the heated reactive gas is sprayed over the surface of the material that needs to be etched or ashed. The energy transfer from the gas to the substrate helps to remove the material while preserving the shape and integrity of the parts. The last stage is the cooling process in which a large volume of coolant is passed through the etching chamber to reduce the temperature of the chamber to the desired levels for the best results. This combination of induction, heating and cooling helps to create the unique etching process that allows for precise and accurate etching results. BMR ICP is a highly efficient etching and ashing system that is used to create high precision parts with a very low margin of error. It is an essential tool for any laboratory, manufacturing facility, or research and development firm that needs to perform delicate etching and ashing operations in order to produce the desired results. As a result, ICP provides excellent results, with minimal substrate loss and the precision that is needed in many industries.