Used BRANSON / IPC P2100 #9259552 for sale

Manufacturer
BRANSON / IPC
Model
P2100
ID: 9259552
Etchers.
BRANSON / IPC P2100 is a state of the art etching and ashing equipment suitable for a large variety of substrates. This system offers precision etching capabilities and superior process control for complete flexibility. IPC P2100 is a high-performance wet-etching and ashing unit ideal for a variety of applications in the R&D field and production environments. It uses a low-impact process and top-down procedure to achieve optimal etch and ash effects on the substrate. This machine is compatible with both photomasks and quartz wafers with a maximum size of 300mm. The tool uses a combination of oxygen and ozone through its unique advanced peroxide-based etching process. The three-stage process of etching includes a pre-clean, etch, and post-clean. During the pre-clean stage, the oxide layer is broken down and removed from the substrate. During the etch stage, the photomask or quartz wafer is etched using the O2/O3 stream. Finally, during the post-clean stage, any remaining residues are removed from the surface. The ozone and oxygen combination allows for a rapid etch rate and precise etching control. The asset also provides high-speed ashing for enhanced productivity. The substrate is subjected to O2/O3 mixtures in order to quickly remove photomasks or delicate quartz wafers. It also offers a wide range of temperatures with an operating range of -05C to 800C to purify and optimize processes. Additionally, the model is capable of in-situ pressure control to withstand the harsh process of etching and ashing. The equipment's user-friendly interface ensures intuitive and simple machine programming. The intuitive touchscreen displays vital process information and enables fast and accurate process programming. Furthermore, BRANSON P2100 offers both error detection and self-diagnosis functions for optimal machine operation. Overall, P2100 is an advanced etching and ashing system capable of providing superior process control by combining high-speed etching, ashing, and post-cleaning operations. This unit is ideal for applications from the R&D field to production and offers precision etching and purification for a wide variety of substrates.
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