Used CANON / ANELVA ILD 4002 #9111252 for sale

CANON / ANELVA ILD 4002 is an advanced etcher and asher equipment designed for deep reactive-ion etching (DRIE) applications in the semiconductor, MEMS, and optoelectronic industries. The system is capable of completing etching and plasma operations with precision and control. CANON ILD 4002 features a comprehensive range of process parameters, enabling complex feature etching over a wide range of materials. This etching unit is suitable for a variety of difficult-to-etch materials, from gallium arsenide (GaAs) to polysilicon. ANELVA ILD 4002's advanced dual-chamber etching machine is designed for precise, repeatable deep-etching capabilities. This etcher features optimized radio frequency (RF) matching and coupled power, while a high-pressure etch environment enables high rate etching in a range of substrates. It also features a wide variety of accessory options that offer flexibility for different etching and ashing operations. The innovative chamber design on ILD 4002 reduces the possibility of contamination, while allowing for easy access to the substrate. This compact etcher and asher tool is capable of deep etching operations on a wide range of materials. It also offers high-accuracy ashing capabilities for precision etch and ashing requirements. The innovative design of CANON / ANELVA ILD 4002 ensures low process temperatures, low off-gassing, and minimum contamination for etching and ashing operations. CANON ILD 4002 offers a range of productivity and high-precision etching and ashing capabilities. It features nanoscale etching capability, with features down to 50nm achievable. Additionally, the asset has a low-temperature etch capability, with etch rates of up to 350 nm/min and post etch cleaning processes. The model also offers a robust variety of etch processes and feature capabilities, including fine-feature selectivity control, etch rates up to 2,500nm/min, and defect-suppression processes. ANELVA ILD 4002 also has a 16" wafer capability, enabling direct wafer processing. In summation, ILD 4002 is an advanced etcher and asher equipment designed to meet the demanding requirements of deep reactive-ion etching (DRIE) applications. It offers high-precision etching and ashing capabilities, as well as nanoscale etching capability and features down to 50nm. This system also has a robust variety of etch processes and feature capabilities, including post etch cleaning processes and defect-suppression processes.