Used CELLO Nasca-20 Plus #293822843 for sale

Manufacturer
CELLO
Model
Nasca-20 Plus
ID: 293822843
Vintage: 2011
Inductively Coupled Plasma (ICP) Etcher HANBELL PS80-S Screw dry pump 2011 vintage.
CELLO Nasca-20 Plus is a highly advanced etcher/asher equipment that offers precise and efficient processing of various semiconductor materials. This tool is designed to meet the demands of the semiconductor industry for high throughput, reliability, and process control, making it a valuable asset for research and production facilities. In this comprehensive technical description, we will delve into the key features, functionality, and specifications of Nasca-20 Plus. CELLO Nasca-20 Plus utilizes advanced plasma etching and ashing technology to remove and pattern thin films on semiconductor wafers with exceptional precision and uniformity. This system is equipped with a variety of process gases and energy sources that enable it to etch and ash a wide range of materials such as silicon dioxide, silicon nitride, metal films, and organic materials. One of the standout features of Nasca-20 Plus is its versatile process capabilities, which allow users to tailor the etching and ashing parameters to achieve specific material removal rates, selectivity, and sidewall profiles. The unit can accommodate wafer sizes up to 200mm and offers customizable process recipes to meet the requirements of various applications, from advanced CMOS device fabrication to MEMS and photonics. CELLO Nasca-20 Plus is equipped with a reliable vacuum machine that ensures a clean processing environment and consistent performance. The tool features advanced endpoint detection techniques that enable real-time monitoring of the process progression and accurate endpoint determination, leading to improved process control and reproducibility. In terms of plasma generation, Nasca-20 Plus employs high-frequency RF sources to create a low-pressure plasma environment that effectively removes material from the wafer surface. The asset includes temperature control features to mitigate thermal effects on the wafer during processing and ensure uniform etching and ashing across the substrate. To enhance user experience and productivity, CELLO Nasca-20 Plus is equipped with an intuitive user interface that allows operators to easily program process recipes, monitor model status, and access diagnostics information. The equipment also offers remote monitoring and control capabilities, enabling seamless integration into automated production environments. Safety is a top priority in the design of Nasca-20 Plus, with features such as interlocks, gas flow monitoring, and emergency shutdown mechanisms to protect operators and the equipment from potential hazards. The system complies with industry standards for equipment safety and ergonomic design to ensure a secure working environment. Overall, CELLO Nasca-20 Plus is a state-of-the-art etcher/asher unit that combines advanced process capabilities, reliable performance, and user-friendly operation. Whether used for R&D purposes or high-volume production, this tool excels in delivering precise and uniform material processing for a wide range of semiconductor applications. Its robust design, versatility, and safety features make it a valuable asset for semiconductor manufacturers looking to achieve higher yields and faster time-to-market for their products.
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