Used DENTON VACUUM Z-Flex #293798648 for sale

ID: 293798648
Wafer Size: 12"
Ion Beam Deposition (IBD) system, 12" INFICON IC6 Quartz crystal rate controller with dual sensor head Single wafer load lock Water-cooled chamber (2) Sets of linear chambers (2) Turbo pumps (2) Dry scroll pumps Water pump Water cooled stage Wafer rotation speed: 15-35 RPM Turret with (4) Targets, 10" Deposition ion source: ICP RF Source: 14 cm Etch ion source: ICP RF Source: 36 cm.
DENTON VACUUM Z-Flex is a cutting-edge etcher/asher equipment that offers advanced capabilities for plasma surface treatment applications. This highly efficient and reliable tool is designed for precise and controlled processing of various materials to achieve desired surface properties for a wide range of industries including semiconductor, microelectronics, MEMS/NEMS, and biomedical. At the core of Z-Flex system is its state-of-the-art plasma generation technology. The unit utilizes a high-density plasma source to create a uniform and stable plasma environment that ensures consistent processing results. The plasma source is powered by a RF generator that controls the plasma parameters such as density, temperature, and chemistry to tailor the surface treatment process according to specific requirements. One of the key features of DENTON VACUUM Z-Flex machine is its flexibility in processing different types of materials. Whether it is dielectric materials, metals, semiconductors, polymers, or ceramics, the tool is capable of providing precise etching/ashing processes to modify surface properties such as roughness, adhesion, wettability, and chemical reactivity. This flexibility allows users to address a variety of surface modification challenges in their research or manufacturing processes. Furthermore, Z-Flex asset offers a range of process gases and reactive species to enable a wide array of surface treatment options. Users can choose from a variety of gases such as oxygen, argon, nitrogen, and others to control the chemical environment within the process chamber. Additionally, reactive gases like CF4, SF6, and others can be introduced to enhance the etching/ashing capabilities for specific material types. The model is equipped with advanced process monitoring and control features to ensure accurate and reproducible results. Real-time monitoring of plasma parameters such as gas flow rates, pressure, power levels, and temperature allows users to optimize the process conditions for maximum efficiency and quality of surface treatment. The equipment also includes automated process recipes and control software that streamline the operation and reduce user intervention, making it easy to achieve consistent and repeatable results. In terms of safety and convenience, DENTON VACUUM Z-Flex system is designed with user-friendly features and robust construction. The unit is equipped with safety interlocks, emergency stop buttons, and alarms to ensure operator safety during operation. The chamber design is optimized for easy loading and unloading of samples, and maintenance tasks are simplified for minimal downtime and maximum productivity. Overall, Z-Flex etcher/asher machine is a versatile and reliable tool for precise surface treatment applications in various industries. With its advanced plasma generation technology, flexibility in processing different materials, and comprehensive process control features, the tool offers users a powerful solution to achieve superior surface modification results with high efficiency and repeatability.
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