Used DNS / DAINIPPON SPW-813A #293642853 for sale

DNS / DAINIPPON SPW-813A is an advanced etcher that is capable of processing buried structures, flat substrates, and devices complicated three-dimensional structures. This advanced etching technology can achieve resolutions of up to 1.8µm. DNS SP-W813-A is capable of etching many substrates, including silicon substrates, tungsten, polyimides and polymers. It is also suitable for single or multi-flight use on a wide range of semiconductor substrates. This advanced etcher makes use of the dry strip method to precisely strip off any coating that may be present on the substrate. DAINIPPON SPW-813-A is capable of etching complex three-dimensional structures that are medically relevant. This allows for a vast number of applications, from producing sound sensors to producing vibration sensors. The minimum line width and depth that can be achieved depends on the type of resistor used, with a standard line width of 1.9 µm and line depth of 0.15 µm. DAINIPPON SPW-813A is equipped with the latest automatic loading and unloading equipment and can handle up to 60 wafers per hour. This provides high throughput etching capabilities and makes it ideal for high volume production requirements. SP-W813-A uses a specially designed gas delivery system to provide a steady, uniform flow of reactive gas during etching processes. This chamber utilizes a proprietary multi-zone planar heater design with a unique heater unit with adjustable temperature and pressure levels. The HEPA-type filter installed on the chamber ensures the cleanliness of the entire process. This advanced etcher is self-contained with an integrated vacuum system that can handle vacuum of up to 10-6 Torr (760 millibar). The process chamber is enabled with a fully automated, twenty-four-step cycle time, providing reliable and repeatable etching of all materials. SPW-813A is an excellent choice for etching applications for the medical device industry, consumer electronics, and semiconductor applications. The dry strip etching process combined with high throughput etching capabilities provides a reliable and efficient way to create complex and minute three-dimensional structures.