Used DNS / DAINIPPON SPW-813A #293643042 for sale

DNS / DAINIPPON SP-W813-A Wafer Grinding, Lapping & Polishing Equipment provides a high precision and efficient solution for the effective and reliable preparation of both hard and brittle sample materials. The system is designed for batch processing to enable both individual sample sizes and full-size wafers to be accurately prepared for further advanced testing, diagnostics, and analysis. The unit features both a fine grinding and lapping head, allowing for simultaneous adjustment of the grinding pressure, the speed of various tools, and the degree of finishing required. A user-friendly control panel offers clear instructions and simple control of parameters, while an LED display offers surface assessment feedback when making adjustments. The powerful main motor drives both the grinding/lapping head and the turntable, providing high speed and high precision motion across all desired directions to ensure uniform surface textures. The machine also includes an enclosed water cooling tool with adjustable flow rate, which helps maintain consistent temperature during the grinding and lapping process. With its ergonomic design, DNS SP-W813-A enables easy loading and unloading of wafers with minimal effort, offering the user a range of options for wafer sizes and types, from small or large wafers, to non-round, non-radial, or cylindrical wafers. The asset also features a vacuum chucking model for securing the wafer in place for processing, and an advanced de-chucking equipment for separate removal of each wafer after the process is complete. The use of advanced components, an extremely sturdy frame design, and low noise levels make DAINIPPON SPW-813A Wafer Grinding, Lapping & Polishing System a reliable and high-performance solution for all wafer preparation needs.