Used GASONICS / NOVELLUS Aura 1000 #9188601 for sale

GASONICS / NOVELLUS Aura 1000 is an advanced etcher/asher used for advanced lithography processes that are used in the fabrication of integrated circuits (ICs). GASONICS Aura 1000 is designed to support a wide range of applications and processes, such as high end gate oxidation, chemical vapor deposition (CVD), physical vapor deposition (PVD), and ion implantation. It utilizes a multiple stage etch/ash process for precise process control and improved etch quality. NOVELLUS Aura 1000 is assembled using a robust, modular and scalable design that offers a reliable working environment and long-term equipment reliability. It is capable of processing wafers up to 300mm in diameter and with a thickness range of 0.35mm. The system features a multiple-stage architecture that provides precise process control and improved etch quality. It features automated lid-lifting, loading and unloading systems with full shelf-to-shelf uniformity. Aura 1000 has the capability to deliver high levels of resolution and high aspect-ratio etching with minimal sidewall damage. It is equipped with several advanced components including a high-resolution scanner, an advanced micro-processor, and a precision sputtering gun. These components are designed to deliver extremely precise etching capabilities, including control over fine feature support spacing and line widths. GASONICS / NOVELLUS Aura 1000 is equipped with a high-zone scan control (ZSC) unit for precise etching of small features. It also has fast scan capability for rapid etch rates. The machine's advanced micro-processor feature ensures the rapid implementation of etching programs. Its ultra-high-speed scan control ensures more precise etching of small features. Additionally, the tool is equipped with powerful cleaning technologies, such as a high-pressure atomized deionized water baths, which enable efficient and effective cleaning of post-etch substrates. In summary, GASONICS Aura 1000 is an advanced etcher/asher used for high-end lithography processes. It is a modular and scalable asset that can process wafers up to 300mm in diameter and with a thickness range of 0.35mm. The model is equipped with several advanced components such as a high-resolution scanner, an advanced micro-processor, and a precision sputtering gun. Additionally, it has fast scan capability for rapid etch rates, ultra-high-speed scan control for fine feature support spacing and line widths, advanced cleaning technologies, and a high-zone scan control (ZSC) equipment for precise etching of small features.