Used GASONICS / NOVELLUS Aura 2000 #9247828 for sale
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ID: 9247828
Wafer Size: 8"
Asher, 8"
Model no: 99-0339
Install type: Tabletop
Machine runtime: 11,028 Hours
Filament runtime: 16,005 Hours
Wafer passes: 7132
Includes:
AURA 2000LL PR Strip
BOC EDWARDS NGH425100 Main chamber pump
BOC EDWARDS iQDP40 LL Pump
Microwave generator:
NATIONAL ELECTRONICS A95-045-01-E
Position: Main chamber
Gas line / Gas / MFC Make / MFC Model
1 / O2 / HONEYWELL / MIDAS-E-LEL
2 / N2H2 / HONEYWELL / MIDAS-E-LEL.
GASONICS / NOVELLUS Aura 2000 is an etcher/asher used for a variety of applications, such as photolithography, semiconductor device manufacturing, and wafer level packaging. It is designed to precisely etch structures at small feature sizes, while maintaining clean sidewalls in the etch process. The etching process takes place in a vacuum chamber, making it ideal for low-temperature processes requiring no protective blanket of ambient air. GASONICS Aura 2000 utilizes a variety of technologies to achieve its desired end results. These include a laser-induced plasma etch process, Plasma Enhanced Chemical Vapor Deposition (PECVD) processes, ion-beam etching, and a range of downstream processing. The laser-induced plasma etch process creates a precise etch pattern using a laser beam and an inert gas plasma. It produces a sharp, clean line with no edge roughness, perfect for complex features. PECVD processes allow for low temperature deposition of silicon oxides and other materials in a vacuum environment. This process is ideal for creating difficult structures which are not possible with conventional techniques. Ion beam etching is used to fine-tune the etch process by controlling the energy, direction, and velocity of ions in the process. It is particularly effective for high aspect ratio (HAR) and submicron structures. Finally, NOVELLUS Aura 2000 comes with a full range of downstream process solutions. This includes post-etch cleaning, sidewall passivation, film optimization, and materials analysis. This allows for fast and precise control over the etching process, resulting in perfect results. In summary, Aura 2000 is a powerful etching and ashing machine that is designed to produce a precise, clean etch pattern at small feature sizes. It uses a combination of laser-induced plasma etch, PECVD processes, and ion beam etching, along with on-board downstream processing to produce perfect results.
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