Used GASONICS / NOVELLUS Aura 2000 #9247831 for sale

GASONICS / NOVELLUS Aura 2000 is a type of etcher/asher equipment which uses a radio frequency (RF) power source to etch and clean feature depths in more than one semiconductor wafer simultaneously. This system is designed to perform both etching and cleaning functions without the need for a substrate or pre-treatment. In the etching process, the source of energy is usually an RF wave which is generated by the unit's magnetron. In the cleaning, a pristine gas, such as Argon, is used to remove the slag particles created from the etching process. GASONICS Aura 2000 machine is characterized by its high level of process control and uniformity, which is a result of its advanced wide area plasma source technology. This technology ensures that the RF frequency is evenly distributed across the substrate, ensuring uniform etching and cleaning. Furthermore, its deep plasma source enables it to etch and clean feature depths greater than 75 nanometers. Its ultra-low-noise design also enables it to achieve successful cleaning results, even in very small feature sizes. Moreover, NOVELLUS Aura 2000 features several advanced technologies that allow users to maximize process performance. Examples of these features include high-speed processing, high-purity operation, advanced hardware and software control features, high-speed cycle times, and remote monitoring capabilities. With its comprehensive control package, users can easily monitor and adjust process parameters to ensure consistent throughput. Aura 2000's advanced design also allows users to customize the tool to their particular needs. This customizability allows users to adjust gas flows, RF powers, and other parameters to achieve the best results. Additionally, its large chamber and advanced heating and cooling mechanisms provide temperature control to further optimize hardware performance. Overall, GASONICS / NOVELLUS Aura 2000 is an advanced etcher/asher asset with a wide range of features and capabilities. Its RF power source, wide-area plasma source, and customizable features make it an ideal tool for etching and cleaning semiconductor wafers. Its high level of process control and uniformity allow users to maximize their productivity, while its advanced hardware and software features provide users with comprehensive control over the process. By using GASONICS Aura 2000, users can easily etch and clean feature depths greater than 75 nanometers and achieve successful results.