Used GASONICS / NOVELLUS Aura 2000LL #293605212 for sale

GASONICS / NOVELLUS Aura 2000 is a high performance plasma etcher/asher designed for a wide range of processes in wafer fabrication. GASONICS Aura 2000 sports a high-vacuum (HV)-plasma technology that enables ultra-fast etching and ashing of the substrate by delivering high ion energy and cleaning the process chamber efficiently. This etcher can handle substrate sizes up to 12" in diameter and process temperatures up to 1000°C. NOVELLUS Aura 2000 has a variety of features that make it a leader among etchers and ashers. Its proprietary Ultra-High-Density Plasma technology allows for efficient etch and ash rates, decreasing the process times by as much as twenty times compared to other etch systems. This means Aura 2000 can handle complex processes with a wide range of etch types, including Reactive Ion Etching (RIE) and Dry-Plasma etching. The ultra-fast etching speed combined with its ability to chemically passivate wafers before deposition means GASONICS / NOVELLUS Aura 2000 can deliver consistent performance while reducing process costs. GASONICS Aura 2000's robust vacuum chamber and high-performance control systems help reduce overhead costs associated with maintaining a sustained ultra-high vacuum environment. In addition, the advanced optics system allows the operator to observe the process in real-time using the pass-through viewing windows, enabling quick and accurate troubleshooting. NOVELLUS Aura 2000 utilizes automated and flexible recipes to ensure repeatability among the various process steps, allowing it to remain consistent while repeating wafer process steps. Aura 2000 claims to have a better than 4nm resolution accuracy, allowing it to bring precision to your etch and ash processes implementing nanolasers as well as conventional and digital image enhancement. The etch also includes an advanced hermetic sealing which allows for higher process speeds and yields due to reduced oxidation and contamination. GASONICS / NOVELLUS Aura 2000 is a cutting-edge plasma etcher/asher that can handle a variety of wafer substrates sizes from 12" in diameter. It features a proprietary Ultra-High-Density Plasma technology for faster processing, a robust vacuum chamber for efficient maintenance, advanced optics for real-time monitoring, and automated and flexible recipes for repeatability. Its hermetic sealing and high-performance control systems help reduce overhead costs and its resolution accuracy is better than 4nm. GASONICS Aura 2000 is guaranteed to deliver optimal etch and ash processes while reducing overhead costs.