Used GASONICS / NOVELLUS Aura 3010 #9111883 for sale

ID: 9111883
Wafer Size: 8"
Ashers, 8" Parts systems.
GASONICS / NOVELLUS Aura 3010 is an advanced etcher/asher designed for semiconductor wafer processing. Utilizing a unique play of advanced vacuum, chamber and process materials, and a unique approach to in-situ surface cleaning, it provides flexible and efficient reaction capabilities that reach through multiple etch/ash stacks. In addition, the system comes with an integrated range of optical, acoustic, and thermal sensors that ensure precise execution of process recipes and can monitor chamber presence, thermal gradients, and exposure time. The result is a remarkably powerful etcher/asher with a wide variety of process recipes anda wide range of process times. GASONICS Aura 3010 features an ultra-high-vacuum chamber that offers a clean and controlled environment for wafer processing. Developed through a combination of high-end vacuum technology and advanced materials, this advanced chamber provides a low-temperature, low-contamination etch/ash environment. Additionally, its single-wafer process load lock structure keeps the chamber completely isolated from the surrounding area, and reduces contamination to such a degree that it ensures consistent high-quality processing results. NOVELLUS Aura 3010 is further equipped with a suite of advanced process tools, such as etch/ash fluxer, and a paddle-free, purge-free, ultra-high-reliability, thermal-gradient control that provides efficient wafer uniformity. Its advanced optical system is also designed to reduce sputter rates and maximize etch uniformity. Additionally, its controller can automatically control in-situ cleaning and wafer loading in order to minimize operator exposure time. Finally, Aura 3010 is capable of a wide range of etch/ash process recipes, including single step etch, dual step etch, post etch, combination etch, post etch/ash, rapid-pass etch, passivation etch, and gap-filling, among others. This allows it to process various wafer sizes, materials and thicknesses. Its total range of process times is also fine-tuned to accommodate the ever-changing demands of the semiconductor industry. As a result, it is capable of providing ultra-short processing times, increased throughput, decreased defectiveness and excellent yields.
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