Used GASONICS / NOVELLUS PEP 3510 Plus #293753218 for sale
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GASONICS / NOVELLUS PEP 3510 Plus is an etcher/asher designed for advanced semiconductor device processing. It is a multi-platen etcher/asher with four individually independently loaded wafer platen holders. The machine has advanced features such as advanced process control, high throughput, and low total cost of ownership. GASONICS PEP 3510 Plus features a single wafer processing chamber that has optimized etching and ashing capabilities. It has an easy to access front load/unload door to enable wafer transfer and loading in one step. It has a wafer holding mechanism to ensure precise motion and proper wafer-to-chamber alignment. The chamber includes the Layer Etch Dispense (LED) process to provide superior plasma etch control and enable precise layer thickness control. NOVELLUS PEP 3510 Plus also features an optimized high-throughput end-point detection algorithm (ETD) to reduce process variability and improve layer uniformity. It uses automated in-situ process monitoring with the Layer Etch Monitor (LEM) to reduce waste and minimize layer thickness loss by monitoring etch process parameters and process time. Finally, PEP 3510 Plus has a Resource Smart feature which enables it to identify the optimal recipe and process cycle to achieve desired device structure properties, improve device yield and reduce total cost of ownership. GASONICS / NOVELLUS PEP 3510 Plus is designed to handle the highest throughput requirements of advanced semiconductor device processing and give superior results. It has high temperature Titanium etch chambers for uniform etching and superior ashing characteristics. It also features low-energy input settings to reduce particle contamination and increase device reliability. The high-precision results of GASONICS PEP 3510 Plus enable sub-20nm level etch and ashing in standard gap and complex designs. The machine has also been designed to meet applicable safety standards, including OSHA, NFPA and CSA. Overall, NOVELLUS PEP 3510 Plus is a multi-platen etcher/asher with features to increase process control, enable precise layer thickness control, reduce process variability, minimize layer thickness loss, and reduce total cost of ownership. It is designed with high throughput capabilities and optimized end-point detection to ensure superior process results. This makes it an ideal choice for advanced device processing.
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