Used HITACHI U-722 #150986 for sale

HITACHI U-722 is an etcher / asher equipment designed for use in the manufacture of semiconductor wafers. It is a dry-etch system consisting of a plasma source and a Faraday cage. The plasma source consists of inductively coupled plasma and RF discharge modules, and the Faraday cage is a dielectric-lined enclosure which is used to protect the wafers from direct exposure to the plasma. U-722 has an ICP source capable of generating a power level of up to 1,200w and is equipped with two 400w and two 800w inductively coupled plasma (ICP) sources. The plasma is generated by a gas mixture of argon, hydrogen and oxygen. The plasma is created by the ICP plasma source and is contained within the Faraday cage. The wafers are then exposed to the plasma which produces a chemical etching process. This etching process removes material from the wafer surface, resulting in patterns that can be used to create complex circuit structures and components. HITACHI U-722 is a compact and easy to use unit. The device features intuitive software allowing for precise control of the etching parameters and the RF power supply, which can be adjusted to provide optimal etch results. It also includes a built-in computer for data storage and manipulation. U-722 is suitable for a variety of materials, including silicon, silicon oxide, tungsten, titanium, and titanium-nitride. It is also suitable for wafer sizes from 4" to 8", and is able to achieve etching rates up to 10 nm/min. The machine also features a wide range of etching parameters, allowing users to achieve 'self-patterning' etch processes. HITACHI U-722 has an excellent etching capability and is considered to be one of the best etching systems on the market. It is used in a variety of fields, including the manufacture of integrated circuits, optoelectronic devices and components for telecommunications. U-722 is reliable, robust and highly economical, making it an ideal solution for many semiconductor manufactures around the world.