Used JESAGI JSPES-W21 #9144083 for sale

JESAGI JSPES-W21 etcher is a high-quality vacuum etching system that is designed for top-down wafer processing. On JSPES-W21 platform, a wide range of advanced features are available to optimize designs and enable rapid process development. With JESAGI JSPES-W21, more than 120 different process recipes can be stored, and recipes are easily adjustable and scalable for individual substrate types and designs. It utilizes built-in proprietary encapsulation technology that holds the wafer at a precise distance to the substrate, ensuring uniform etching across the surface. It features a protective stainless steel hood, a double-sealed vacuum chamber, and a user-friendly interface that allows users to customize recipes and select different etching methods. All operations and functions can be controlled via an LCD touchscreen, and it also provides USB ports for easy updating and installation of external devices. JSPES-W21 etcher offers a programmable, automated platform with capabilities including process optimization, substrate lifetime prediction, and experimentation with recipes for higher resolution and deeper material removal. It is also equipped with onboard diagnostics that allow users to monitor and analyze the etching process, and PID control systems that maintain high accuracy and high throughput. The entire platform is equipped with layers of dust prevention, such as a silicone filter, to halt the spread of airborne particles during the etching process. JESAGI JSPES-W21 also provides additional safety as it automatically shuts down if unexpected events occur. In summary, JSPES-W21 etcher is an advanced high-quality vacuum etching system that provides precise control and powerful automation for top-down wafer processing applications. It offers user-friendly operation, reliable safety, and precise control with its built-in protective stainless steel hood, double-sealed vacuum chamber, user-friendly touchscreen, and onboard diagnostics. It is also capable of optimizing processes, predicting substrate lifetime, and experimenting with recipes for higher resolution and deeper material removal.