Used LAM RESEARCH 2300 Exelan Flex 45 #9292910 for sale

LAM RESEARCH 2300 Exelan Flex 45
ID: 9292910
Wafer Size: 12"
Dielectric etcher, 12".
LAM RESEARCH 2300 Exelan Flex 45 is an etcher/asher featuring an On-Axis processing chamber with direct-driving of the Turbo-Molecular Pump assembly. This etcher/asher offers high speed and precise control of the etching process, with low downtime and process variability. The On-Axis processing chamber design provides uniform and repeatable plasma-etching of wafers on all areas of the wafer simultaneously, allowing for high-throughput and precise plasma uniformity. This chamber also allows for direct-driving of the Turbo-Molecular Pump assembly, which offers improved pumping efficiency and results in significantly lower maintenance requirements. This etcher/asher allows for polysilicon etching, and the On-Axis processing chamber possesses adjustable features to facilitate fine-tuning of the etching process. The Exelan Flex 45's powerful generator offers precise control of the main etching parameters, such as etch power, frequency, and process pressure. The generator also contains a high purity remote plasma source (RPS) with "closed" toroid magnet that can be used to selectively etch compounds and materials. The etcher/asher also includes an extensive range of safety features with data logging and monitoring systems that ensure maximum nominal pressure and chamber temperature. Furthermore, the Exelan Flex 45's Closed-Loop system regulation technology enhances wafer uniformity, productivity, and reliability by ensuring the etching parameters are kept at their optimal levels. Additionally, the Exelan Flex 45 has a wide range of applications for various etching processes. It can be used for various etches, such as chemical deep etch, contact etch, ion milling, reactive ion etch, ashing, and discharge chamber etch. The etcher/asher is also designed with a high temperature capability up to 450ºC and a dedicated local exhaust system that can remove harmful process by-products such as ozone, oxygen, and nitrogen. The Exelan Flex 45 is compatible with a variety of gases, including argon, helium, hydrogen, and nitrogen, and is able to handle small and large quantities of gasses for its applications. The Exelan Flex 45 is an efficient and versatile etcher/asher that provides repeatable plasma etching and ashing results. Its On-Axis processing chamber design and Closed-Loop system regulation technology maximize throughput and wafer uniformity while minimizing downtime and process variability. This etcher/asher is an ideal tool for a range of etching processes and its wide range of applications and safety features make it a valuable addition to any laboratory.
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