Used LAM RESEARCH 2300 Exelan Flex #9061909 for sale

LAM 2300 is a vacuum equipment with a vertical load lock chamber combined with a resist coating system. The resist coating process is used to deposit a protective layer of material on the substrate. 2300 is a versatile, full-featured unit capable of creating sophisticated device structures. LAM 2300 utilizes a diffusion-limited resist coating technology to uniformly deposit a protective layer of material such as wax, antireflection, and/or positive photoresist on a substrate. The machine also allows for precise control of the layer thickness and etch uniformity. The Vacuum Load Lock, combined with the precision etching and resist deposition capabilities, enables users to precisely control process conditions, resulting in precise control of the results. 2300 is an advanced, computer-controlled tool that can be operated in either manual or automatic modes. The operator can adjust the process parameters, such as pressure, temperature, and time, in a few steps. The computerized controls allow the operator to easily monitor and adjust the process parameters, helping ensure process repeatability. LAM 2300 is equipped with a PZT (Piezo-electro-transferscope) for etching thin and thick films. The PZT accurately transfers electric pulses to the substrate, enabling the asset to precisely etch thin and thick resist films. The model can also be used to etch wafers, discs, strips, and other similar substrates. 2300 is capable of processing a wide range of materials, including metals, oxides, nitrides, and polymers. It is also capable of performing blanket and patterned etch, as well as photolithography and plasma etching. The equipment can be used to coat, select and pattern substrates with a variety of coating chemistries, including spin-on glass and EUV/UV antidiffusion coatings. LAM 2300 resists coating system is extremely efficient and reliable. It is easy to use and maintain, and is capable of producing high-quality etching and resist deposition results. The unit is ideal for the fabrication of complex structures, such as MEMS, thin film transistors, and microassembly components. This machine is an ideal choice for high-throughput and high-precision device fabrication.