Used LAM RESEARCH 2300 Exelan #9083803 for sale
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ID: 9083803
Wafer Size: 8"
Vintage: 2004
Oxide etcher, 8"
Cass nest plastic, 8"
Wafer shape: SNNF (Semi notch no flat)
(4) Process chambers:
Position 1: 2300 Exelan
Position 2: 2300 Exelan
Position 3: 2300 Exelan
Position 4: 2300 Exelan
Front end load port cassette:
(3) Open cassettes iPX
Backing pumps for TM iPX
User interface option: Side and front monitor UI
Earth leakage breaker ELB
Signal tower
SECS / GEM
Plat from type: Version 2
2300 Exelan options:
Chamber type: 2300 Exelan CFE
Upper electrode heated
ESC Cooling dual zone
1600 L/S EDWARDS Turbo pump, 8"
Endpoint detection optical emission spectroscopy
Chamber isolation valve rocker gate valve
2300 Gas box:
Gas system type: Enhanced gas box II
Std stacking kits: 4 PM stacking kit
Gas line 12 gas configuration
Gas box inlet option: Regulated inlet gas panel
Gas filters: Standard filter
Gas box configuration:
PM1 MFC Type: Unit 1661 metal, digital
Line 1 Ar 1000 sccm
Line 2 O2 50 sccm
Line 3 N2 200 sccm
Line 4 O2 2000 sccm
Line 5 CHF3 100 sccm
Line 6 C4F8 20 sccm
Line 7 CH2F2 50 sccm
Line 8 C4F8 50 sccm
Line 9 CF4 100 sccm
Line 10 NSR70%He/30%O2100 sccm
Line 11 C4F6 20 sccm
Line 12 NSR Xe 300 sccm
Line 13 HeO2 20 sccm (Tuning gas)
PM2 MFC Type: Unit 1661 metal, digital
Line 1 Ar 1000 sccm
Line 2 O2 50 sccm
Line 3 N2 200 sccm
Line 4 O2 2000 sccm
Line 5 CHF3 100 sccm
Line 6 C4F8 20 sccm
Line 7 CH2F2 50 sccm
Line 8 C4F8 50 sccm
Line 9 CF4 100 sccm
Line 10 NSR70%He/30%O2100 sccm
Line 11 C4F6 20 sccm
Line 12 NSR Xe 300 sccm
Line 13 HeO2 20 sccm(Tuning gas)
PM3 MFC Type: Unit 1661 metal, digital
Line 1 Ar 1000 sccm
Line 2 O2 50 sccm
Line 3 N2 200 sccm
Line 4 O2 2000 sccm
Line 5 CHF3 100 sccm
Line 6 C4F8 20 sccm
Line 7 CH2F2 50 sccm
Line 8 C4F8 50 sccm
Line 9 CF4 100 sccm
Line 10 NSR70%He/30%O2100 sccm
Line 11 C4F6 20 sccm
Line 12 NSR Xe 300 sccm
Line 13 HeO2 20 sccm(Tuning gas)
PM4 MFC Type: Unit 1661 metal, digital
Line 1 Ar 1000 sccm
Line 2 O2 50 sccm
Line 3 N2 200 sccm
Line 4 O2 2000 sccm
Line 5 CHF3 100 sccm
Line 6 C4F8 20 sccm
Line 7 CH2F2 50 sccm
Line 8 C4F8 50 sccm
Line 9 CF4 100 sccm
Line 10 NSR70%He/30%O2100 sccm
Line 11 C4F6 20 sccm
Line 12 NSR Xe 300 sccm
Line 13 HeO2 20 sccm (Tuning gas)
2300 Peripherals:
DFC Backing pumps cust supply
DFC TCU Config lam supply: (4) 4080 Plus
Gas scrubber: EBARA GTE-3-0WVT
Power distribution module: RPDB
Dry pumps:
TM EDWARDS iPX 100A
PM1 EBARA AA100W
PM2 EBARA AA100W
PM3 EBARA AA100W
PM4 EBARA AA100W
No SMIF interface
2004 vintage.
LAM RESEARCH 2300 Exelan is a technologically advanced etcher and asher specifically designed for high-volume production of semiconductor devices. The Exelan is capable of etching and ashing at high speeds while still providing extremely precise results. Its unique semi-aqueous chemical process ensures a consistently uniform structure and surface quality. The equipment is capable of performing high-throughput etching and ashing of silicon wafers, and can handle a maximum of three 200-mm (8-inch) wafers at a time. The Exelan is equipped with advanced process control and integration capabilities for process-automated operations. Its high-precision optical white light system enables the unit to perform etching and ashing with precision and accuracy. Its advanced automation machine provides a localized and flexible control strategy that allows simultaneous control of various process parameters. The integrated robotic arm helps minimize the cycle time, while providing repeatable results. The machine's software controls provides a complete range of process control and integration capabilities.t includes a wide range of variables such as high-precision optical registration systems, auto-stabilization control systems, precision wafer orientation systems, and integrated robotic arms. The tool is equipped with an extensive library of recipes that can be accessed and reused for applications with similar set of processing requirements. The Exelan also offers a comprehensive suite of process, diagnostic and data analysis functions. The asset features a process minirobot with automatic wafer loading and unloading. Additionally the model has built-in diagnostic tools which allows monitoring and analysis of the etching and ashing process. The equipment also offers process control software that enables engineers to tune their processes for optimal performance and efficiency. The Exelan's modular design enables customization for additional features such as nitrogen inerting systems, recirculation systems, and additional chemical deliverance systems. The system is compliant with various safety and environmental standards and has passed various safety checks throughout various testing regimes. The unit has been proven to help reduce the cost of ownership and provide a low total cost of operation. Overall, 2300 Exelan is an advanced machine capable of high-performance etching and ashing tasks. The tool is ideal for high-volume production applications such as semiconductor device manufacturing as it enables time- and cost-efficient operations. The asset's integrated process control and automation capabilities provide a consistent and repeatable performance, while its wide range of process, diagnostic, and data analysis functions ensures process optimization and efficiency.
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