Used LAM RESEARCH 2300 Flex 45 #9255641 for sale

LAM RESEARCH 2300 Flex 45
ID: 9255641
Wafer Size: 12"
Vintage: 2013
Etchers, 12" 2013 vintage.
LAM RESEARCH 2300 Flex 45 is an etcher/asher specifically designed for plasma etching and plasma ashing processes. It is part of the FLEX series of etchers/ashers, which are characterized by excellent plasma uniformity and high process precision when performing complex, high-temperature processes. This multi-step etcher/asher offers high-volume parallel etching and ashing capabilities, providing maximum throughput. 2300 Flex 45 utilizes a proprietary EDGE plasma technology, allowing the equipment to deliver superior step-etching and ashing performance. This allows for excellent feature definition and repeatability. LAM RESEARCH 2300 Flex 45 features a processing chamber with a 15-inch diameter that is designed for batch-mode or single wafer processing. It is capable of high pressure operation and is capable of up to five configurable process steps. It can process thermal budget up to 2000 Watts and pressure budgets up to 70 mTorr, allowing for complex processing. 2300 Flex 45 also features LAM RESEARCH state-of-the-art process automation technology, providing flexibility and accurate process control. Its precision dOsC controller maintains high process repeatability and full wafer coverage across all steps. To ensure high process quality, the etcher/asher features a tilting wafer chuck and flexible wafer-holding mechanism that keeps wafers secure during etched and ashed processes. In addition, this system includes a number of safety features, including multiple safety interlocks and sensors that monitor unit parameter overvoltage, temperature, pressure, and a host of other parameters. This gives the machine an edge in reliability, durability, and overall performance. Overall, LAM RESEARCH 2300 Flex 45 is an advanced etcher/asher tool that can perform a wide variety of processes with higher efficiency and precision, while providing excellent process economics, and safety. It is an excellent choice for high-volume plasma processing applications.
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