Used LAM RESEARCH 2300 Flex 45 #9258556 for sale

LAM RESEARCH 2300 Flex 45
ID: 9258556
Wafer Size: 12"
Vintage: 2013
Etcher, 12" 2013 vintage.
LAM RESEARCH 2300 Flex 45 is an etcher/asher that offers atomic layer etching/ashing in a single platform. It offers the flexibility to produce advanced circuits and high-density packaging components, such as wafer-level packages, such as flip-chip, 3D-IC, and advanced 2.5D integration. 2300 Flex 45 utilizes a chemical vapor deposition (CVD) based etch/ash technology, providing precise etch/ash at the atomic level. The process is also capable of providing significantly improved etching/ashing of dielectric and metals. LAM RESEARCH 2300 Flex 45 features low temperature processing parameters, eliminating the risk of thermal damage to the substrate. This is enabled by the equipment's ability to precisely control the temperatures in the reaction chamber. Additionally, 2300 Flex 45 employs a unique dual-wavelength laser system that allows unprecedented process flexibility. LAM RESEARCH 2300 Flex 45 supports a wide variety of wafer sizes, up to 300mm, including the ability to switch between wafer types on the fly. The unit also features advanced monitoring of process conditions, allowing control of critical process parameters in order to achieve consistent product quality. 2300 Flex 45 has a very low pressure chamber, allowing for higher surface mobility and a faster reactant diffusion, which leads to a more uniform etch/ash chemistry. This further enables better throughput and quality capabilities. The machine also has a range of optional components such as an RTC tool, advanced remote monitoring capabilities and an on/offline slicing asset. In conclusion, LAM RESEARCH 2300 Flex 45 is a high performance etcher/asher that offers precision etch/ash at the atomic scale, with low temperature processing. Its unique design features provide unprecedented flexibility and improved product quality, resulting in improved throughput. This model is ideal for a range of advanced circuit and packaging applications and provides a reliable, cost-effective solution for etching/ashing of fine structures.
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