Used LAM RESEARCH 2300 Flex EX #9270870 for sale

LAM RESEARCH 2300 Flex EX
ID: 9270870
Systems.
LAM RESEARCH 2300 Flex EX is a precision etcher/asher that is engineered to deliver accuracy and speed for etching and ashing precise and intricate structures. This equipment features a large process chamber that can be heated from room temperature up to 500°C, allowing for the ashing of a wide variety of semiconductor and MEMS materials. The active O2, N2 and PLOT gases, along with the turbo pumping technology, provide a vacuum environment within the chamber for optimal etching and ashing performance. The system features a robotically arm with a positionable wafer handling platform. This combined with the advanced software and robotics provides the operator with maximum flexibility and capability in programming and running the unit. The machine supports automatic loading and unloading of substrate with optional specialty cassettes, enabling through-wafer etching or ashing and efficient split plane process runs. The LAM 2300 Flex EX is designed with a high accuracy wafer alignment tool for superior accuracy in handling wafers. This asset also features YFS (YieldFocus Software) - an automated optimization algorithm to optimize the etching and ashing conditions according to specific criteria set by the operator. Additionally, it comes with a real-time wafer position and metric tracking model for precise and accurate wafer patterning. This equipment further incorporates advanced process control and data logging functions for in-run and post-run process diagnosis. The O2, N2, PLOT gases can be tuned accurately to create a stable process environment. Moreover, the LAM LAM RESEARCH 2300 Flex EX provides an array of process metrology options such as ECD (Electrical Content Deposition) and XRF (X-ray Fluorescence). To conclude, 2300 Flex EX is a highly efficient and precise etcher/asher designed to meet the most stringent demands of the semiconductor and MEMS fabrication process. The system utilizes real-time metrology and process control to ensure high yield and low defects while offering maximum flexibility, accuracy and speed.
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