Used LAM RESEARCH 2300 Flex #9244818 for sale

LAM RESEARCH 2300 Flex
ID: 9244818
Wafer Size: 12"
Vintage: 2005
Etcher, 12" 2005 vintage.
LAM RESEARCH 2300 Flex is an etcher/asher equipment designed for precision etch processing. The system is designed to provide uniform etch depth, aspect ratios, and edge topographies in advanced microelectronic devices and thin film products. 2300 Flex offers advanced features such as high-resolution control of the etch process, automatic alignment of the etch process, and adaptive etch corrections. These features make the unit ideal for processes involving precise etch profiles, such as MEMs etching. The machine also features a unique multi-source configuration which allows for switching between different gases based on process requirements. This allows for an expanded variety of etch recipes that can meet specific customer needs. LAM RESEARCH 2300 Flex provides the flexibility to precisely control the etch process by providing a variety of chamber geometries. These include circular, rectangular, module, and customized shapes. Furthermore, the tool can be equipped with advanced sensors, controllers, and driven components for tight control of the etch process parameters. 2300 Flex can be configured with a wide variety of process components, allowing for a variety of etch processes. These can include Reactive Ion Etching (RIE), Reactive Ion Beam Etching (RIBE), low pressure chemical vapor deposition (LPCVD), plasma enhanced chemical vapor deposition (PECVD), sputter etching, rapid thermal processing (RTP) and dry etching. LAM RESEARCH 2300 Flex also includes a range of plasma source options, such as capacitively coupled plasma (CCP), inductively coupled plasma (ICP), and direct current (DC) power sources, allowing for enhanced process control and specific process requirements. Overall, 2300 Flex is an ideal asset for precise etching applications, with capabilities for both high-resolution etch profiles and rapid throughput times. It is also capable of conducting a variety of etch processes, allowing maximum flexibility for custom needs.
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