Used LAM RESEARCH 2300 Flex #9244863 for sale

LAM RESEARCH 2300 Flex is a highly complex, large scale etcher/asher equipment designed for the production of integrated circuit (IC) wafers. This multi-wavelength etch/ash system is capable of processing a variety of materials, including silicon, quartz, and metals. 2300 Flex integrates a single chamber design, which eliminates the need for chamber swapping. This feature allows LAM RESEARCH 2300 Flex to provide higher yields as material transfer between chambers is not necessary during the etching process. The unit is comprised of a multi-wavelength source, ICP waveguide, and computer control unit to provide maximum process flexibility. The machine is equipped with an advanced ion beam source which can generate high energy photoresist sputtering, reactive etch/ash, and neutral etch/ash. This feature makes 2300 Flex ideal for producing ICs with demanding performance requirements. LAM RESEARCH 2300 Flex also includes a precision laser stage, which can provide precise alignment of features within the etching and/or ashing process. The tool is equipped with an advanced computer controller with user-defined parameters that offer high degree of process flexibility. In addition, 2300 Flex supports an automated loadlock asset and evacuable bell-jar for improved process performance and cycle-time optimization. This enables wafer nozzle monitoring and alignment without the need to manually exchange wafer carriers. LAM RESEARCH 2300 Flex's combination of advanced high-energy photoresist sputtering, reactive etching and neutral ashing options make it an ideal choice when producing cutting-edge ICs with demanding performance requirements. It is capable of increasing productivity due to its single-chamber design and automated load-lock model. Furthermore, it offers a high degree of process flexibility through its computer controller along with precise feature alignment capabilities through its precision laser stage. These features combined make 2300 Flex the perfect etch/ash solution for growing high performance IC requirements.