Used LAM RESEARCH 2300 Kiyo3x #9212622 for sale

ID: 9212622
Vintage: 2008
Chamber 2008 vintage.
LAM RESEARCH 2300 Kiyo3x etcher is an automated chemical-mechanical polishing (CMP) equipment, designed for advanced dielectric and metal etch layer processing for chip development applications. The Kiyo3x system offers enhanced planarization and feature profile control for critical dielectric and metal CMP application, resulting in improved device yield, lower total cost of ownership, and optimal process integration. The LAM 2300 Kiyo3x features a number of advanced components, including the patented Micro-Positioning Unit (MPS), which enables precise and repeatable substrate alignment and motion between two mechanical stages. This provides micron-level repeatability for extremely uniform etch layer results. The Kiyo3x can be equipped with up to two liquid controllers and two LAM Endura modelled CMP processes, allowing for custom configurations to fit specific application requirements. LAM RESEARCH 2300 Kiyo3x is designed with advanced process control capabilities. The machine can control up to four process parameters using either post-processing analysis or in-situ metrology. In addition, the Kiyo3x features an advanced process control tool which offers real-time process control and feedback on monitored results. The Kiyo3x can be configured with a variety of both conventional and unified chemical and mechanical stages and process recipes. The mechanical stages offer a wide range of motion and rotation to accommodate a variety of processing needs. 2300 Kiyo3x also includes a range of patented nozzle and substrate adapter designs for Precise Feature Control, delivering a range of profile shapes and feature resolution for sophisticated etch layers. LAM RESEARCH 2300 Kiyo3x provides great performance and a wide range of capabilities for metal and dielectric etch layer processes so it can provide precise, optimized results for a variety of chip development applications. The asset offers excellent feature profile control and planarization for optimal production yields and lowered total cost of ownership. Additionally, precise real-time process control and monitoring ensure optimal device yield and process repeatability.
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