Used LAM RESEARCH / ONTRAK 2300 Kiyo45 #9245885 for sale

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ID: 9245885
Wafer Size: 12"
Vintage: 2009
Etcher, 12" 2009 vintage.
LAM RESEARCH / ONTRAK 2300 Kiyo45 is an asher / etcher used for subtractive processes to create miniaturized features on substrates. It is equipped with a two-chamber design that allows the user to simultaneously etch different layers without having to stop the process and reload the chamber with a new substrate. The Kiyo45 has a 21-inch, high-resolution, X-Y stage, twice the speed of its predecessor, and a motorized stage offering quick and precise repeatability for process optimization. The Kiyo45 is a subtractive process etcher and is designed with two reactors - upper and lower. The upper chamber is equipped with Inductively Coupled Plasma (ICP) source, consisting of a RF power supply and source chamber. The ICP source provides a high density RF plasma, which is ideal for etching of metals and other hard materials. The lower chamber is equipped with a high-density, high-power, low-pressure plasma (DPP) source. The DPP source is used for etching of a wide variety of materials, from ceramic to films and resins. The Kiyo45 also comes with a spin-to-clamp (STC) chuck to provide uniform wafer contact and prevent damage during processing. Additionally, the Kiyo45 is equipped with a stiction-free, 1000 step/second, X-Y motorized stage to maximize process speed and accuracy. Further, the X-Y stage is fast responding and repeatable for the quick and precise process optimization. The Kiyo45 is offered with a powerful Multi-View Viewing System allowing the user to control and monitor the process through real-time data viewing. The accompanying CONTROL ESC software package gives the user control over various etch parameters such as RF power, pressure, gas flow rates, and timing sequences. The Kiyo45 etcher / asher is a reliable and robust tool for production of micro-structures on a wide variety of substrates. It is designed for cost-effective operation, and serves as an ideal solution for etching of thin film layers, a variety of substrates, and advanced process development and research.
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