Used LAM RESEARCH 2300 Versys Kiyo #9359216 for sale
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ID: 9359216
Wafer Size: 12"
Etcher, 12"
(3) Process chambers
V2 Platform
Transfer chamber:
BROOKS AUTOMATION Transfer robot
Transfer robot ARM
(6) Rocker valves
TM Pressure gauge
MKS 640 TM Pressure control
Loadlock pressure gauge (Hasting gauge)
VAT Slit door
TM Super slot board
Airlock cover
DA Sensor
Etch chambers PM2/PM3:
2300 Kiyo, 2005 vintage
Pressure gauges:
E28B-30584
(2) 625A-14059
65048-JH52 Pendulum valve
ATH2300M Turbo pump
Apex 1513 TCP RF Generator, P/N: 660-032596-013
Apex 1513 Bias RF Generator, P/N: 660-032596-014
RF Matches:
TCP, P/N: 832-034908-009
Bias, P/N: 832-038915-001
ESC, P/N: 839-019090-328
Missing process kits:
Top edge ring
Bottom edge ring
Wall liner
649A-14943 Back He UPS
ESC Power supply
VME Assembly
Foreline assembly
OES
Luxtron
Etch chamber PM4:
2300 Kiyo Chamber
Pressure gauges:
E28B-30584
(2) 625A-14059
65048-JH52 Pendulum valve
ATH 2300M Turbo pump
Apex 1513 TCP RF Generator, P/N: 660-032596-013
Apex 1513 Bias RF Generator, P/N: 660-032596-014
RF Matches:
TCP, P/N: 832-034908-009
Bias, P/N: 832-038915-001
ESC, P/N: 839-019090-328
Missing process kits:
Top edge ring
Bottom edge ring
Quartz injector
Wall liner
649A-14943 Back He UPS
ESC Power supply
VME Assembly
Foreline assembly
OES
Luxtron
(3) Gas panels:
PM2:
IGS Gas panel
12-Stick gas channels
SEC-Z300 Mass Flow Controllers (MFC)
PM3/PM4:
IGS Gas panel
16-Stick gas channels
SEC-Z300 Mass Flow Controllers (MFC)
Gases for PM2/PM3/PM4:
Gases / Size
CL2 / 200 SCCM
HBR / 50 SCCM
CF4 / 200 SCCM
O2 / 20 SCCM
O2 / 200 SCCM
HE / 500 SCCM
SF6 / 200 SCCM
CH4 / 50 SCCM
HBR / 500 SCCM
CHF3 / 200 SCCM
N2 / 100 SCCM
AR / 500 SCCM
Delivery and pre-charge gas line
GIB Line and FIB cover
Gas box cover.
LAM RESEARCH 2300 Versys Kiyo etcher/asher is the latest in a line of leading edge etch/ash tools from LAM RESEARCH, a leading supplier of semiconductor process equipment. It is designed to be a highly efficient, high throughput equipment capable of reproducing tight dimensional control and high-fidelity surfaces. It is ideal for a variety of processes including advanced and multi-layer etch/ash applications. The Versys Kiyo utilizes advanced RF technology to provide the highest precision etch/ash processes. Its state-of-the-art process control and diagnostics provides superior performance and reliability that yields superior device yields and allows for higher process throughputs. The tool's advanced temperature control technology also ensures high accuracy and reproducibility. The machine's wafer handling capabilities also provide a key advantage in its design, as the Versys Kiyo is equipped with an efficient, configurable wafer transfer system and a 20 station cluster tool cassette loader. This ensures fast, reliable loading and unloading of wafers, an important feature for any etch/ash tool. The unit also provides for flexibility with its programmable power and frequency capabilities, enabling processes to be customized for a range of device types, including fine line, ultra-thin lines, and other complex geometries. Furthermore, a full range of state-of-the-art RF power functions, such as pulsed power, linear power ramps, and programmable waveform shapes, are available to further extend etch/ash process flexibility. To provide the highest levels of machine accuracy and traceability, the Versys Kiyo etcher/asher includes an integrated metrology package and advanced surface imaging techniques. These features are designed to maximize process control and reproducibility and provide the highest possible imaging accuracy and resolution for wafers. Finally, the Versys Kiyo etcher/asher is designed to have low operating costs, which helps maximize cost savings for both device manufacturers and end users. The sophisticated user-friendly operation allows operators to quickly understand and utilize the Versys Kiyo's capabilities, helping to reduce the cost of resources invested in setup and operator training. Overall, 2300 Versys Kiyo etcher/asher provides a superb combination of advanced etching performance, high wafer throughput, configurability, and low operating costs. This makes it an ideal tool for a variety of intricate etch/ash processes.
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