Used LAM RESEARCH 2300 Versys #78825 for sale

LAM RESEARCH 2300 Versys Kiyo 45 is a highly advanced etch-assembler solution designed to meet the demands of advanced etch-assembling requirements. This product facilitates higher levels of performance, accuracy and yields while reducing costs. This etcher / asher uses industry-leading directed plasma etching (DPE) technology to provide excellent etch accuracy and uniformity, as well as high-density device feature assembly. LAM RESEARCH 2300 VERSYS KIYO45 offers 42 process chambers, each equipped with DPE capabilities, allowing for the integration of over 300 process recipes. Each chamber is supplied with deposition, etch, and anneal modules, and 12 high-resolution mass spectrometers. Each chamber has a 4 inch by 5.2 inch (200 mm) by 6.5 inch (500 mm) window, providing excellent optical access and large wafer area. The chamber has superior optics quality, enabling superior overlay accuracy, and the low chamber background pressure, combined with the high supply flow, makes for enhanced etch process quality. 2300 Versys Kiyo 45 is designed to optimize throughput and can process up to 450 wafers per hour. It can provide repeatable etch profiles for large batch manufacturing, and has a high degree of process recipe flexibility with its DPE technology, allowing for more efficient process integration. 2300 VERSYS KIYO45 is designed for use in production environments, and can be operated in a safe and secure manner. Its integrated process control system, LED-liftable substructures, automatic wafer and cassette feeders, and fail safe processes help ensure maximum wafer yield while minimizing maintenance time. The system is also flexible to accommodate changes in production requirements. LAM RESEARCH 2300 Versys Kiyo 45 is ideal for chip manufacturing and packaging, offering superior accuracy and yields, as well as high quality and repeatability. This advanced system provides an excellent solution to etch and assemble complex devices while reducing the overall cost of production.