Used LAM RESEARCH 2300 Versys #9195904 for sale

LAM RESEARCH 2300 Versys
ID: 9195904
Reactive Ion Etch (RIE) system Process: Metal etch Integrated Circuit (IC) Wires and electrical connections Metal Hard Mask (MHM) Typical mask Flexible platform Controlling repeatable profiles Critical Dimensions (CD) BEOL Metal etching MHM Increase selectivity of low-dielectric insulating films With BEOL integration Controlling trench dimensions and roughness bottom line Interfere with productivity and compensating power Metal Hard Mask (MHM) (TiN) High density aluminum line Aluminum pad.
LAM RESEARCH 2300 Versys is an advanced etcher / asher designed for high throughput DRIE (Deep Reactive Ion Etch) and ICP (Inductively Coupled Plasma) etching applications. This etcher features a dielectric chamber and an advanced feed-forward control system, making it the perfect choice for high-throughput production environments. The feed-forward control system of 2300 Versys ensures that the etching process is highly uniform, enabling smooth and repeatable production processes. It also comes with high-resolution sensors to monitor critical etching process parameters, allowing for fine-tuned control throughout the process. LAM RESEARCH 2300 Versys is well-suited for DRIE applications, as it is capable of achieving high etch rates and smooth sidewall profiles that are ideal for aggressive etching of dielectric materials. It features uniform gas flow within the etching environment, which allows for precise control over the etching rate, as well as repeatable results. 2300 Versys also offers high power radio frequency (RF) source options, including sources for ICP etching. This allows for both DRIE and ICP process cycles to be carried out in sequence, increasing process flexibility and efficiency. Furthermore, LAM RESEARCH 2300 Versys can easily be integrated into large-scale automated production environments, allowing for large-scale etching applications. Overall, 2300 Versys is an advanced, high-throughput etcher / asher designed for both ICP and DRIE applications. This etcher offers precise and repeatable etching processes due to its advanced feed-forward control system, uniform gas flow, and high power RF source options. Furthermore, it can easily be integrated into large-scale automated production environments, making it an ideal choice for high-throughput etching applications.
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