Used LAM RESEARCH 2300e4 Exelan Flex DX #9385677 for sale
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ID: 9385677
Wafer Size: 12"
Vintage: 2015
Dielectric etcher, 12"
Type: (3) FOUPs
User interface: Side and front monitor U
(3) Hermos Carrier ID
Light curtain with OHT / RGV
25 Slots input buffer station
Conditioning station
UPS Circuitry system
Earth leakage breaker
TM-Subpanel cable: 100 ft
Calibration and alignment system
Air intake system: MEV
NSR8423 Hardware firewall
Differential pressure: ATM
Skywhite front fascia
Wafer flow tuning
APC Recipe tuning host
2nd HSMS
4XX Series ESC
Flow meter: 10 GPM
Dual PM facilities
With temperature monitor
Generator: 60 MHz
Adjustable gap
Dual zone ESC Cooling
Standard conductance kit
Heated foreline manometer
Interconnect hardware:
Pump to TCU: 100 ft
TCU to PM: 100 ft
Pump to PM: 100 ft
EMO Cable:
TCU to RPDB: 50 ft
Pump to RPDB: 50 ft
Talon
Quick clean kit
(3) 2300 Gas boxes
(30) Jetstream gas lines
(6) Heated gas lines
(3) NSR MFC
(17) Facility interface boxes
2015 vintage.
LAM RESEARCH 2300e4 Exelan Flex DX is a dry etcher / asher designed for high-volume three-dimensional electronics and large area deposition applications. It offers considerable improvement over other etchers and ashers in terms of throughput, process control, and process repeatability. 2300e4 Exelan Flex DX has an advanced deposition process that allows its use in a variety of applications. It is commonly used for thin film deposition, as well as etching and ashing of large area substrates. It has four selectable sources including XeF2, O2, NF3, Cl2, and Ar. The Exelan Flex DX can be configured to accommodate a wide range of materials and substrates. One of the key advantages of LAM RESEARCH 2300e4 Exelan Flex DX is its high-throughput capability. It is capable of producing up to 37u layers per hour, depending on the configuration and process parameters used. The etcher / asher is fully automated for accurate and repeatable processes, with embedded process control and process monitoring. 2300e4 Exelan Flex DX also offers superior process quality. Its adjustable plasma density and pressure control ensures improved uniformity and repeatability of the deposition process. The Exelan Flex DX is also equipped with an advanced cleaning system, which helps streamline the cleaning process and improve process repeatability. Additionally, LAM RESEARCH 2300e4 Exelan Flex DX offers several important safety features. These include an auto-shutdown feature in case of an emergency or process irregularity, as well as load-lock and substrate holder safety systems. These safety features enable the etcher / asher to be used in a wide range of applications with minimum risk. Overall, 2300e4 Exelan Flex DX is an advanced etcher / asher designed for high-volume three-dimensional electronics and large area deposition applications. It offers superior throughput and process quality, as well as important safety features to ensure optimal safety and process repeatability.
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