Used LAM RESEARCH 2300e4 Exelan Flex DX #9385677 for sale

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ID: 9385677
Wafer Size: 12"
Vintage: 2015
Dielectric etcher, 12" Type: (3) FOUPs User interface: Side and front monitor U (3) Hermos Carrier ID Light curtain with OHT / RGV 25 Slots input buffer station Conditioning station UPS Circuitry system Earth leakage breaker TM-Subpanel cable: 100 ft Calibration and alignment system Air intake system: MEV NSR8423 Hardware firewall Differential pressure: ATM Skywhite front fascia Wafer flow tuning APC Recipe tuning host 2nd HSMS 4XX Series ESC Flow meter: 10 GPM Dual PM facilities With temperature monitor Generator: 60 MHz Adjustable gap Dual zone ESC Cooling Standard conductance kit Heated foreline manometer Interconnect hardware: Pump to TCU: 100 ft TCU to PM: 100 ft Pump to PM: 100 ft EMO Cable: TCU to RPDB: 50 ft Pump to RPDB: 50 ft Talon Quick clean kit (3) 2300 Gas boxes (30) Jetstream gas lines (6) Heated gas lines (3) NSR MFC (17) Facility interface boxes 2015 vintage.
LAM RESEARCH 2300e4 Exelan Flex DX is a dry etcher / asher designed for high-volume three-dimensional electronics and large area deposition applications. It offers considerable improvement over other etchers and ashers in terms of throughput, process control, and process repeatability. 2300e4 Exelan Flex DX has an advanced deposition process that allows its use in a variety of applications. It is commonly used for thin film deposition, as well as etching and ashing of large area substrates. It has four selectable sources including XeF2, O2, NF3, Cl2, and Ar. The Exelan Flex DX can be configured to accommodate a wide range of materials and substrates. One of the key advantages of LAM RESEARCH 2300e4 Exelan Flex DX is its high-throughput capability. It is capable of producing up to 37u layers per hour, depending on the configuration and process parameters used. The etcher / asher is fully automated for accurate and repeatable processes, with embedded process control and process monitoring. 2300e4 Exelan Flex DX also offers superior process quality. Its adjustable plasma density and pressure control ensures improved uniformity and repeatability of the deposition process. The Exelan Flex DX is also equipped with an advanced cleaning system, which helps streamline the cleaning process and improve process repeatability. Additionally, LAM RESEARCH 2300e4 Exelan Flex DX offers several important safety features. These include an auto-shutdown feature in case of an emergency or process irregularity, as well as load-lock and substrate holder safety systems. These safety features enable the etcher / asher to be used in a wide range of applications with minimum risk. Overall, 2300e4 Exelan Flex DX is an advanced etcher / asher designed for high-volume three-dimensional electronics and large area deposition applications. It offers superior throughput and process quality, as well as important safety features to ensure optimal safety and process repeatability.
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