Used LAM RESEARCH 2300e4 KIYO MCX #9252292 for sale

LAM RESEARCH 2300e4 KIYO MCX is a multi-chamber etcher / asher designed for volume production in the semiconductor industry for etching and ashing of silicon wafers. It provides a reliable, highly automated solution to deep etching and ultra-fine ashing needs. The KIYO MCX offers efficient gas utilization, high throughput, and high process quality. The KIYO MCX is designed to provide an ultra-fine etching and ashing process, which is critical for high drop rate, gap formation, and step-coverage. It incorporates advanced technologies such as LiPS (Lithography, Plasma Source) and IMPRIME (Ionized Metal Plate Reactor) to provide a high-end etch process with high accuracy and tight control of etching rates. The KIYO MCX also features a new Argon-rich F2 Chemistry to enhance process performance and flexibility. The KIYO MCX is configured with two dual chambers and one single chamber. Each dual chamber is designed for etch process and ashing process, respectively. The single chamber which is located between these dual chambers is configured for physical cleaning and adhesion cleaning. The KIYO MCX chamber utilizes the latest technologies such as ICP (Inductively Coupled Plasma), Sub TIP (Sub-Thermal Ionization) and external cavity sources (ECS) to provide superior performance. All three chambers are integrated into one unit and managed centrally by a custom Motion Controller. The KIYO MCX also offers a wide range of control and safety features. It is configured with internal safety sensors and customer adjustable floor-level emergency stops. It is also equipped with sophisticated thermal monitoring and isolation systems to protect the process from thermal shocks. Additionally, the KIYO MCX is designed for high-efficiency gas utilization, which results in lower gas consumption and reduced costs. Furthermore, its advanced software provides process monitoring, recipe execution, analysis functions, and a data logging system. The KIYO MCX etch / asher system is designed specifically for the needs of volume production in the semiconductor industry. By incorporating advanced technologies such as LiPS, IMPRIME, Argon-rich F2 Chemistry, ICP, Sub TIP and ECS, it is able to provide superior etch / ashing processes with extremely high accuracy. Additionally, it offers a wide range of control and safety features, which is essential for process safety in high-volume production. Finally, its advanced software provides process monitoring, recipe execution, analysis functions, and a data logging system to maximize process efficiency and cost savings.