Used LAM RESEARCH 2300e5 KIYO EX #293637365 for sale
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ID: 293637365
Wafer Size: 12"
Vintage: 2014
Polysilicon etcher, 12"
(4) Load ports
Gases: SiCl4, BCl3, Cl2, HBr, CF4, O2, SF6, He, C4F6, CH2F2, Ar, NF3, N2 and SO2
Chambers: PM1, PM2, PM3, PM4 and PM5
Does not include Hard Disk Drive (HDD)
Power supply: 200 AC, 3 Phase
2014 vintage.
LAM RESEARCH 2300e5 KIYO EX etch / ash equipment is a heavy-duty multi-chamber system designed for a variety of deep etch and ash processes for advanced semiconductor device fabrication. The KIYO EX is used for producing high aspect ratio etched structures with very high precision and a wide range of etching depths. It is equipped with a 5-axis table for precise substrate positioning and a variety of etch and ash process chambers, including a low-pressure chemical vapor deposition unit, a deep reactive ion etcher (RIE) machine, and an inductively coupled plasmas (IPC) tool. The asset is compatible with both regular and Pyrex wafers with thicknesses up to 4mm. The KIYO EX's RIE model is equipped with updated hardware and software components to enable high speed, precise etching of deep, narrow trenches in a range of silicon-based materials such as Si, SiGe, and SiC. It also includes a continuous plasma source with a wide range of gas mixtures and RF frequencies, allowing for a precise tuning of etch rates and depth profiles. The IPC equipment features wide/raised source antennas and a large effective area, enabling low-power operation for difficult-to-etch materials. It is also equipped with an onboard de-cluster module and the ability to tune etch parameters for specific materials. The KIYO EX system also offers several process automation capabilities, such as wafer mapping and chamber purging, to improve process repeatability and uptime. It also supports advanced substrate handling and quality control through optical, thermal, and metrology module integration. Advanced process control options, such as closed-loop etch monitoring, also allow for precise process optimization. In addition to generalized etch and ash processes, the unit can be configured for a variety of advanced processes and feature sizes. With its flexible process capability, 2300e5 KIYO EX etch / ash machine provides a versatile and powerful platform for wafer fabrication.
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