Used LAM RESEARCH 2300e5 KIYO EX #293797205 for sale

ID: 293797205
Wafer Size: 12"
Vintage: 2015
Polysilicon etcher, 12" (3) Cassettes TDK TAS 300 Loadport KAWASAKI NT510 Robot Chamber type: Kiyo E PM1, PM2, PM3, PM4, PM5 KASHIYAMA MU100XU-200 Loadlock pump (5) EDWARDS IXM600M Chamber pump MARUYAMA HCL203-LD Chiller SECS II Interface (2) Channels Chamber position PM1, PM2, PM3, PM4, PM5: EDWARDS STP-XA2703CV ADVANCED ENERGY Apex 1513 RF Generator ADVANCED ENERGY Paramount Gas box configuration: PM1: P/N 571-065780-xxxx PM2: 571-065780-702 PM3: 571-065780-H7829 PM4: 571-065780-H7829 PM5: 571-065780-H7829E Line / Gas / Size 1 / SiCl4 / 100 sccm 2 / BCl3 / 500 sccm 3 / CHF3 / 300 sccm 4 / CH3F / 300 sccm 5 / CH2F2 / 100 sccm 6 / C2H4 / 20 sccm 7 / CF4 / 200 sccm 8 / SF6 / 200 sccm 9 / Cl2 / 500 sccm 10 / HBr / 500 sccm 11 / O2 / 300 sccm 12 / N2 / 500 sccm 13 / NF3 / 500 sccm 14 / He / 500 sccm 15 / Ar / 500 sccm 16 / H2 / 200 sccm Tuning / O2 / 50 sccm STG / He / 300 sccm Signal lamp tower Cables Operating system: Windows 10 CE Marked Power supply: 208 V, 3 Phase, 400 A 2015 vintage.
LAM RESEARCH 2300e5 KIYO EX etch / ash equipment is a heavy-duty multi-chamber system designed for a variety of deep etch and ash processes for advanced semiconductor device fabrication. The KIYO EX is used for producing high aspect ratio etched structures with very high precision and a wide range of etching depths. It is equipped with a 5-axis table for precise substrate positioning and a variety of etch and ash process chambers, including a low-pressure chemical vapor deposition unit, a deep reactive ion etcher (RIE) machine, and an inductively coupled plasmas (IPC) tool. The asset is compatible with both regular and Pyrex wafers with thicknesses up to 4mm. The KIYO EX's RIE model is equipped with updated hardware and software components to enable high speed, precise etching of deep, narrow trenches in a range of silicon-based materials such as Si, SiGe, and SiC. It also includes a continuous plasma source with a wide range of gas mixtures and RF frequencies, allowing for a precise tuning of etch rates and depth profiles. The IPC equipment features wide/raised source antennas and a large effective area, enabling low-power operation for difficult-to-etch materials. It is also equipped with an onboard de-cluster module and the ability to tune etch parameters for specific materials. The KIYO EX system also offers several process automation capabilities, such as wafer mapping and chamber purging, to improve process repeatability and uptime. It also supports advanced substrate handling and quality control through optical, thermal, and metrology module integration. Advanced process control options, such as closed-loop etch monitoring, also allow for precise process optimization. In addition to generalized etch and ash processes, the unit can be configured for a variety of advanced processes and feature sizes. With its flexible process capability, 2300e5 KIYO EX etch / ash machine provides a versatile and powerful platform for wafer fabrication.
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