Used LAM RESEARCH 2300e5 KIYO EX #293797205 for sale
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ID: 293797205
Wafer Size: 12"
Vintage: 2015
Polysilicon etcher, 12"
(3) Cassettes
TDK TAS 300 Loadport
KAWASAKI NT510 Robot
Chamber type: Kiyo E PM1, PM2, PM3, PM4, PM5
KASHIYAMA MU100XU-200 Loadlock pump
(5) EDWARDS IXM600M Chamber pump
MARUYAMA HCL203-LD Chiller
SECS II Interface
(2) Channels
Chamber position PM1, PM2, PM3, PM4, PM5:
EDWARDS STP-XA2703CV
ADVANCED ENERGY Apex 1513 RF Generator
ADVANCED ENERGY Paramount
Gas box configuration:
PM1: P/N 571-065780-xxxx
PM2: 571-065780-702
PM3: 571-065780-H7829
PM4: 571-065780-H7829
PM5: 571-065780-H7829E
Line / Gas / Size
1 / SiCl4 / 100 sccm
2 / BCl3 / 500 sccm
3 / CHF3 / 300 sccm
4 / CH3F / 300 sccm
5 / CH2F2 / 100 sccm
6 / C2H4 / 20 sccm
7 / CF4 / 200 sccm
8 / SF6 / 200 sccm
9 / Cl2 / 500 sccm
10 / HBr / 500 sccm
11 / O2 / 300 sccm
12 / N2 / 500 sccm
13 / NF3 / 500 sccm
14 / He / 500 sccm
15 / Ar / 500 sccm
16 / H2 / 200 sccm
Tuning / O2 / 50 sccm
STG / He / 300 sccm
Signal lamp tower
Cables
Operating system: Windows 10
CE Marked
Power supply: 208 V, 3 Phase, 400 A
2015 vintage.
LAM RESEARCH 2300e5 KIYO EX etch / ash equipment is a heavy-duty multi-chamber system designed for a variety of deep etch and ash processes for advanced semiconductor device fabrication. The KIYO EX is used for producing high aspect ratio etched structures with very high precision and a wide range of etching depths. It is equipped with a 5-axis table for precise substrate positioning and a variety of etch and ash process chambers, including a low-pressure chemical vapor deposition unit, a deep reactive ion etcher (RIE) machine, and an inductively coupled plasmas (IPC) tool. The asset is compatible with both regular and Pyrex wafers with thicknesses up to 4mm. The KIYO EX's RIE model is equipped with updated hardware and software components to enable high speed, precise etching of deep, narrow trenches in a range of silicon-based materials such as Si, SiGe, and SiC. It also includes a continuous plasma source with a wide range of gas mixtures and RF frequencies, allowing for a precise tuning of etch rates and depth profiles. The IPC equipment features wide/raised source antennas and a large effective area, enabling low-power operation for difficult-to-etch materials. It is also equipped with an onboard de-cluster module and the ability to tune etch parameters for specific materials. The KIYO EX system also offers several process automation capabilities, such as wafer mapping and chamber purging, to improve process repeatability and uptime. It also supports advanced substrate handling and quality control through optical, thermal, and metrology module integration. Advanced process control options, such as closed-loop etch monitoring, also allow for precise process optimization. In addition to generalized etch and ash processes, the unit can be configured for a variety of advanced processes and feature sizes. With its flexible process capability, 2300e5 KIYO EX etch / ash machine provides a versatile and powerful platform for wafer fabrication.
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