Used LAM RESEARCH 2300e5 KIYO EXP Poly #293809868 for sale
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ID: 293809868
Wafer Size: 12"
Vintage: 2017
Etcher, 12"
3-FOUP TDK
Light curtain with OHT/RGV
25-Slot aux buffer (corr res)
Conditioning station (7 wafer)
User interface: Side and front monitor
UPS Circuitry
Earth leakage breaker
Cable: TM-Subpanel, 100 feet
Signal light tower, r-o-g-b slim line
VTM Pump: EDWARDS (EPX)
Light curtain
APCS
SVID and Facility interface board
VTM Breakout board/cover
ATM Robot removal kit
Light tower buzzer
NSR10702, N2 Flow monitoring on UPC
NSR101435,TM UPS Bypass kit with Maratho
VTM Robot Lift
Ionizer kit
Robot CDM
STRIP45 and OES Endpoint option
Stainless steel with 5/8-1/2 reducer
2700 l/S BOCE Turbo pump
Gas feed: Top and side
Bias match: 1.5kW HVBP Sync
NSR100999, Chamber exhaust duct
NSR101420, FWD Build Kiyo EX for 173 LTC
NSR101836, Kiyo EXP Chamber process manom
NSR102151, NSR for Kiyo EXP
PM Maint: Quick clean kit
Gas box:
(3) 9-Gas configurations (jetstream)
(21) Jetstream gas line
(9) Heated gas line
AFVi
JS Gas box
(3) NSR100802, GL14 C4F8(100), TG1C4F6(100H)
Facility interface box (system)
(17) Facility interface boxes (per line)
(2) Future PM Containments
2017 vintage.
LAM RESEARCH 2300e5 KIYO EXP Poly is a highly advanced etcher/asher equipment designed for precise and efficient processing of semiconductor materials in the microelectronics industry. This cutting-edge tool is a part of LAM RESEARCH renowned 2300 series, known for its high performance, reliability, and versatility in semiconductor fabrication processes. 2300e5 KIYO EXP Poly incorporates a range of innovative technologies and features to enable superior control and uniformity in etching and ashing processes. One of its key highlights is the KIYO inductively coupled plasma (ICP) source, which delivers high-density plasma with exceptional process stability and repeatability. This advanced plasma source is crucial for achieving precise etching profiles and uniform material removal across the wafer surface. The system is equipped with an expanded process capability for etching and ashing various materials, including polymeric films commonly used in semiconductor device manufacturing. Its enhanced process flexibility allows for the optimization of a wide range of etch chemistries and recipe parameters to meet the specific requirements of different device designs and materials. LAM RESEARCH 2300e5 KIYO EXP Poly features a highly configurable chamber design with multiple wafer handling options, enabling seamless integration into different production environments and processing workflows. The unit supports both single-wafer and batch processing modes, providing operators with the flexibility to choose the most suitable approach based on throughput and process requirements. In terms of process control and monitoring, 2300e5 KIYO EXP Poly is equipped with advanced endpoint detection capabilities, real-time process monitoring tools, and recipe tuning functionalities. These features allow operators to monitor the progress of etching/ashing processes in real-time, make adjustments to process parameters on-the-fly, and ensure consistent and reliable results from run to run. Furthermore, the machine is designed with a focus on productivity and cost-efficiency, incorporating features such as rapid chamber cleaning protocols, efficient gas delivery systems, and auto-calibration mechanisms. These enhancements contribute to minimizing downtime, reducing maintenance costs, and improving overall tool utilization in semiconductor fabrication facilities. In summary, LAM RESEARCH 2300e5 KIYO EXP Poly is a state-of-the-art etcher/asher tool that combines advanced plasma processing technologies, flexible chamber configurations, and robust process control features to deliver high-performance and reliable processing of polymeric materials in semiconductor manufacturing. With its superior process control, excellent uniformity, and versatile capabilities, this tool is a valuable asset for semiconductor companies seeking to achieve high-quality fabrication results and accelerate the development of next-generation devices.
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