Used LAM RESEARCH 4400 #9311438 for sale

LAM RESEARCH 4400 Asher is a plasma processing tool designed to produce etch and deposit layers and structures onto semiconductor wafers. This tool uses an inductively coupled multiRF plasma source and an automated mass-flow™ gas regulation equipment to enable precise gas distribution and seamless process control. The asher can work with a variety of gases and recipes, allowing for wide customization and experimentation. In addition, 4400 features a robust, non-contact IR Gas Monitoring System for full monitoring and real-time process control. LAM RESEARCH 4400 Asher is equipped with x3x and x4x process kits, meaning it can ladle out etch deposit and asher recipes for power amplification purposes. It has a heated loadlock chamber for repeatable and precise substrate handling, a large process chamber for wider wafer handling and a small chamber for quick turn-around processes. 4400 is designed for precise etching, reliable ashing and precise deposition of thin-film layers. It utilizes Kerfless Plasma™ and etch-compensation to control the etch and deposit accuracy. The tool incorporates standoff unit and deposition monitor to control the fluence level of ion bombardment. It also includes a breakthrough coating process that eliminates polymer buildup on the walls of the etch chamber. LAM RESEARCH 4400 has many process parameters such as gas composition, pressure, RF power, RF forward power, RF reversing power, substrate temperature, mass-flow, partial chamber pressure, bias voltage, substrate bias, etc. These paramaters can be finely tuned to provide the best process results. 4400 Asher also comes equipped with its own optional High Resolution Etch Monitor Machine (HRES), an advanced version of the Deposition Monitor which further adds to the capabilities of this tool. It enables the highest possible etch rates and precision for the highest degree of layer accuracy. LAM RESEARCH 4400 Asher is designed to maximize perfomance and yields and to meet the exacting standards of today's demanding siwafer processing. The asher can handle large and small wafer diameters, with a maximum processing area of 406mm. Its repeatable and precise process control allows for smooth, reliable and clean results.