Used LAM RESEARCH 4420 XL #9173005 for sale

LAM RESEARCH 4420 XL
ID: 9173005
Lot of spare parts: Qty Part number Description (2) 715-011753-001 Upper baffle (Upper chamber process Kit 6") (2) 715-011286-080 Lower baffle (Upper chamber process kit 6") (2) 715-019773-206 Upper electrode (Upper chamber process kit 6") (2) 716-011573-001 Upper ceramic ring face (Upper chamber process kit 6") (2) 715-011568-001 Upper clamp electrode ring (Upper chamber process kit 6") (2) 718-094721-26 6" JMF Electrostatic chuck (ESC) (Lower chamber process kit 6") (2) 715-140536-001 Focus ring 6" JMF (Lower chamber process kit 6") (2) 715-030231-003 Edge ring 6" JMF (Lower chamber process kit 6") (2) 716-011451-001 Ceramic filler ring 6" JMF (Lowerchamber process kit 6") (2) - MFC Cl2 200sccm (3) 768-099511-001 Vacuum switch.
LAM RESEARCH 4420 XL is a state-of-the-art etcher/asher that is designed for growing and processing semiconductor materials. LAM RESEARCH 4420XL features an advanced process chamber that has an etch rate of up to 340 nm/min and is capable of achieving a maximum process temperature of 400°C. This allows for fast and efficient etching and ashing of semiconductor materials. Additionally, 4420 XL has a unique in-situ measurement system integrated into the chamber that provides real-time data and feedback about the progress of the etching or ashing process. The system also has an enhanced monitoring and control interface that allows for more accurate and precise operation. 4420XL is especially well-suited to metal etching and patterning processes, whereby patterns of precise metal structures are formed on a substrate. The entire process is highly automated, and LAM RESEARCH 4420 XL can process up to 400 wafers in a single process run, at speeds up to 50 wafers/hour, thanks to its advanced cooling system and adapted feature sets. The automated loading and unloading of substrates is also enabled by automated cassette handlers. LAM RESEARCH 4420XL also features a full suite of process control modules that enable precise control over the etching and ashing process. In addition to standard etching and ashing, 4420 XL also has a unique post-etch up-etch feature that enables the selective removal of a layer of oxidized material from the semiconductor surface without disturbing underlying layers. This is particularly useful in the formation of multi-layer metal structures which are used regularly in industrial production. Overall, 4420XL is an advanced etcher / asher that is designed for growing and processing semiconductor materials. It is capable of achieving high throughput with high accuracy and has unique features that make it particularly suitable for advanced semiconductor processes.
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